SEMICONDUCTOR MEMORY DEVICE
    11.
    发明申请

    公开(公告)号:US20250016992A1

    公开(公告)日:2025-01-09

    申请号:US18763801

    申请日:2024-07-03

    Abstract: A semiconductor memory device includes a substrate, a conductive line disposed on the substrate, a horizontal channel portion extending in a first direction on the conductive line and partially covering the conductive line, a separation insulating layer disposed on the horizontal channel portion, a gate insulating layer including a first portion on the conductive line and a second portion that extends in a second direction that is perpendicular to the substrate, a vertical channel portion between the gate insulating layer and the separation insulating layer, the vertical channel portion extending in the second direction, and a spacer on the first portion of the gate insulating layer. A first material included in the horizontal channel portion is different from a second material included in the vertical channel portion.

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