公开(公告)号：US20200168550A1

公开(公告)日：2020-05-28

申请号：US16556538

申请日：2019-08-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung-kwan Ryu ,  Yun-seok Choi

IPC: H01L23/538 ,  H01L21/56 ,  H01L23/00

Abstract: A semiconductor package includes a base package substrate, a first semiconductor chip, and a second semiconductor chip. The base package substrate includes a redistribution region where a redistribution layer is provided, a plurality of vertical conductive vias connected to the redistribution layer, and a recess region recessed from an upper surface of the redistribution region. The base package substrate further includes an interposer in the recess region, the interposer comprising a substrate, a plurality of upper pads disposed at an upper surface of the substrate, and plurality of through electrodes respectively connected to the plurality of upper pads to pass through the substrate. The first semiconductor chip and second semiconductor chip, each include a plurality of conductive interconnection terminals respectively connected to the plurality of upper pads and the vertical conductive vias exposed at the upper surface of the redistribution region. The first semiconductor chip and the second semiconductor chip are mounted on the extension region and the interposer and disposed horizontally apart from each other. As seen from a plan view, the interposer is disposed to overlap a portion of each of the first semiconductor chip and the second semiconductor chip

公开(公告)号：US10163942B2

公开(公告)日：2018-12-25

申请号：US15375885

申请日：2016-12-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ye-chung Chung ,  Hee-seok Lee ,  Yun-seok Choi ,  Keung-beum Kim

IPC: G06F3/038 ,  H03K3/00 ,  H01L27/12 ,  G02F1/1345 ,  G09G3/20 ,  H01L23/00 ,  H01L25/10 ,  H05K1/14

Abstract: According to example embodiments, an image display panel assembly includes a flexible printed circuit (FPC), an image display panel, at least one gate driver integrated circuit (IC) package, and at least one source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The at least one gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and configured to provide the gate driving signal to gate lines of the plurality of pixels. The at least one source driver IC package is configured to receive the source driving signal through the source driving signal transfer pattern and configured to provide the source driving signal to source lines of the plurality of pixels.