公开(公告)号：US06364466B1

公开(公告)日：2002-04-02

申请号：US09727429

申请日：2000-11-30

申请人： Chien-Hua Chen ,  Kenneth M. Kramer

发明人： Chien-Hua Chen ,  Kenneth M. Kramer

IPC分类号： B41J205

CPC分类号： B41J2/17513 ,  B41J2/1404 ,  B41J2/14145 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2002/14467

摘要： Described herein is a monolithic printhead formed using integrated circuit techniques. Thin film layers, including a resistive layer, are formed on a top surface of a silicon substrate. The various layers are etched to provide heater resistors and conductors. The thin film layers are also etched to expose portions of the upper surface of the substrate where ink feed holes leading into ink chambers are to be formed. A trench is etched in the bottom surface of the substrate while leaving a relatively thin membrane of the substrate underlying the thin film layers. After the trench is formed and using a backside etch, ink feed holes are formed in the substrate membrane leading from the trench to the ink chambers. Ink channels are also formed in the substrate membrane leading to sides of the ink feed holes. These channels preferably have widths smaller than the widths of the ink feed holes. Ink particles or other particles which may clog an ink feed hole opening do not block the narrower channels leading to the sides of the ink feed holes. Various examples of such channels and ink feed holes are described to form a particle-tolerant printhead for use in an inkjet printer.

摘要翻译： 这里描述的是使用集成电路技术形成的单片打印头。 包括电阻层的薄膜层形成在硅衬底的顶表面上。 蚀刻各层以提供加热电阻和导体。 还蚀刻薄膜层以暴露出将要形成通向墨水腔的墨水供给孔的基板的上表面的部分。 在衬底的底表面中蚀刻沟槽，同时留下薄膜层下面的较薄的衬底的薄膜。 在形成沟槽并使用背面蚀刻之后，在从沟槽引导到墨室的基板膜中形成墨水供给孔。 油墨通道也形成在通向油墨供给孔侧面的基板膜中。 这些通道优选具有小于供墨孔的宽度的宽度。 可能堵塞墨水供给孔开口的墨水颗粒或其它颗粒不会阻塞通向墨水供给孔侧面的较窄通道。 描述了这种通道和供墨孔的各种实例以形成用于喷墨打印机的耐磨性打印头。