公开(公告)号：US11335505B2

公开(公告)日：2022-05-17

申请号：US16724712

申请日：2019-12-23

Applicant: TDK CORPORATION

Inventor： Shinya Onodera ,  Takehisa Tamura ,  Atsushi Takeda ,  Yuichi Nagai

IPC: H01G4/248 ,  H01G4/30 ,  H01G4/012

Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a conductive resin layer, a solder plating layer arranged to constitute an outermost layer of the external electrode, and an intermediate plating layer disposed between the conductive resin layer and the solder plating layer. The intermediate plating layer has better solder leach resistance than metal contained in the conductive resin layer. An opening is formed in the intermediate plating layer. The solder plating layer is formed on the conductive resin layer through the opening.

公开(公告)号：US11328866B2

公开(公告)日：2022-05-10

申请号：US16819761

申请日：2020-03-16

Applicant: TDK CORPORATION

Inventor： Yuichi Nagai ,  Atsushi Takeda ,  Takehisa Tamura ,  Shinya Onodera

IPC: H01G4/005 ,  H01G4/33

Abstract: An electronic component includes an element body and an external electrode. The element body includes a principal surface arranged to constitute a mounting surface and an end surface adjacent to the principal surface. The external electrode includes a conductive resin layer disposed to continuously cover a part of the principal surface and a part of the end surface, and a plating layer covering the conductive resin layer. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on a ridge portion between the end surface and the principal surface, and a third region positioned on the principal surface. In a case where a maximum thickness of the first region is T1 (μm) and a minimum thickness of the second region is T2 (μm), the maximum thickness T1 and the minimum thickness T2 satisfy a relation of T2/T1≥0.26.

公开(公告)号：US11152154B2

公开(公告)日：2021-10-19

申请号：US16820138

申请日：2020-03-16

Applicant: TDK CORPORATION

Inventor： Yuichi Nagai ,  Atsushi Takeda ,  Takehisa Tamura ,  Shinya Onodera

IPC: H01G4/232 ,  H01G4/248 ,  H01G4/30

Abstract: An electronic component includes an element body and an external electrode. The element body includes a side surface and an end surface. The external electrode includes a conductive resin layer disposed over the side surface and the end surface. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (μm), a maximum thickness of the second region is T2 (μm), and a minimum thickness of the third region is T3 (μm), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1≥0.11, and the maximum thickness T1 and the minimum thickness T3 satisfy a relation of T3/T1≥0.11.

公开(公告)号：US10818431B2

公开(公告)日：2020-10-27

申请号：US16142212

申请日：2018-09-26

Applicant: TDK CORPORATION

Inventor： Shinya Onodera ,  Takehisa Tamura ,  Atsushi Takeda ,  Ken Morita

IPC: H01G2/06 ,  H01G4/005 ,  H05K1/18 ,  H01G4/232 ,  H01G4/30 ,  H01G4/12

Abstract: An element body of a rectangular parallelepiped shape includes a first principle surface arranged to constitute a mounting surface, a second principle surface opposing the first principle surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed at an end portion of the element body in the third direction. The external electrode includes a conductive resin layer formed on the end surface. A thickness of the conductive resin layer gradually increases from the second principle surface toward the first principle surface in the first direction. The conductive resin layer includes a thickest portion at a position near the first principle surface in the first direction.

公开(公告)号：US10600570B2

公开(公告)日：2020-03-24

申请号：US16166902

申请日：2018-10-22

Applicant: TDK CORPORATION

Inventor： Shinya Onodera ,  Takehisa Tamura ,  Atsushi Takeda ,  Ken Morita

IPC: H01G4/12 ,  H01G4/232 ,  H01F27/29 ,  H05K3/12 ,  H01G4/30 ,  H01G4/005 ,  H01F17/00

Abstract: An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed at an end portion of the element body in the third direction. The external electrode includes a conductive resin layer. The external electrode includes a plating layer including a first portion covering the first principal surface and a pair of second portions covering the pair of side surfaces. A thickness of the first portion is smaller than each thickness of the pair of second portions.

公开(公告)号：US11264171B2

公开(公告)日：2022-03-01

申请号：US16986712

申请日：2020-08-06

Applicant: TDK CORPORATION

Inventor： Yuichi Nagai ,  Takehisa Tamura ,  Shinya Onodera ,  Ken Morita ,  Atsushi Takeda

IPC: H01G4/248 ,  H01G4/12 ,  H01G4/012 ,  H01G4/30

Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (μm) and a maximum thickness of the second region is T2 (μm), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1≥0.11. In a cross-section along a thickness direction of the first region, a total area of voids in the first region is in a range of 5.0 to 36.0% of an area of the first region. In a cross-section along a thickness direction of the second region, a total area of voids in the second region is in the range of 5.0 to 36.0% of an area of the second region.