公开(公告)号：US08828538B1

公开(公告)日：2014-09-09

申请号：US13722154

申请日：2012-12-20

Applicant: The Boeing Company

Inventor： Chin H. Toh ,  James E. Engel

IPC: B32B7/12 ,  B32B15/04

CPC classification number: C09J11/04 ,  C09J7/205 ,  C09J7/21 ,  C09J2205/102 ,  C09J2205/106 ,  Y10T156/10 ,  Y10T156/1105 ,  Y10T428/266 ,  Y10T428/28 ,  Y10T428/2848

Abstract: Doped adhesive tape is used during the manufacture of aircraft, including positioning marks, covering orifices from debris, allowing locations to be marked. Any doped adhesive tape inadvertently left in sub-assemblies during the manufacturing process can be detected using backscatter X-ray inspection technology. Detection is facilitated in one embodiment by making the tape thicker, to produce an increased mass density, and in another embodiment by adding a dopant comprising an element that is readily detected by the backscatter X-ray technology. The element can be iodine, and can be incorporated into the backing layer or the adhesive layer of the tape during manufacturing. The use of both thicker tape and a dopant can be used in combination to facilitate detection. If the doped adhesive tape is detected after components are assembled using a backscatter X-ray inspection device, then the doped adhesive tape is removed.

Abstract translation: 在制造飞机期间使用掺杂的胶带，包括定位标记，来自碎片的覆盖孔，允许标记位置。 可以使用反向散射X射线检查技术检测在制造过程中无意中留在子组件中的任何掺杂的胶带。 在一个实施方案中，通过使带更厚以产生增加的质量密度，并且在另一个实施方案中通过添加包含易于通过后向散射X射线技术检测的元素的掺杂剂来促进检测。 该元件可以是碘，并且可以在制造期间结合到带的背衬层或粘合剂层中。 使用较厚的带和掺杂剂可以组合使用以便于检测。 如果在使用后向散射X射线检查装置组装部件之后检测到掺杂的胶带，则去除掺杂的胶带。