公开(公告)号：US06756660B2

公开(公告)日：2004-06-29

申请号：US10322900

申请日：2002-12-18

申请人： Shoshi Yasunaga ,  Takahiro Ishibashi ,  Hiroaki Narimatsu

发明人： Shoshi Yasunaga ,  Takahiro Ishibashi ,  Hiroaki Narimatsu

IPC分类号： H01L23495

CPC分类号： H01L23/49541 ,  H01L23/49551 ,  H01L24/97 ,  H01L2924/181 ,  H01L2924/00

摘要： A lead frame for a semiconductor device. The lead frame has opposite first and second sides bounded respectively by first and second parallel reference planes between which a thickness is defined. The lead frame has a support with a surface at the first side of the lead frame for receiving a semiconductor chip. A plurality of leads are spaced from the support to be electrically connected to a semiconductor chip on the support. A first lead in the plurality of leads has a length between first and second ends and a width taken transversely to the length. The first end of the first lead has a first region that has a thickness less than the thickness of the first lead at the second end of the first lead so that at least a part of the first region is offset from the second reference plane toward the first reference plane. The first end of the first lead has at least a first protrusion projecting away from the first reference plane.

摘要翻译： 一种用于半导体器件的引线框架。 引线框架具有分别由第一和第二平行参考平面限定的相对的第一和第二侧，其间限定了厚度。 引线框架具有在引线框架的第一侧具有用于接收半导体芯片的表面的支撑。 多个引线与支撑件间隔开以与支撑件上的半导体芯片电连接。 多个引线中的第一引线具有第一和第二端之间的长度以及横向于该长度的宽度。 第一引线的第一端具有第一区域，该第一区域的厚度小于第一引线的第二端处的第一引线的厚度，使得第一区域的至少一部分从第二参考平面朝向 第一参考平面 第一引线的第一端具有至少一个远离第一参考平面突出的第一突起。