Semiconductor device-socket
    13.
    发明授权

    公开(公告)号:US06655974B2

    公开(公告)日:2003-12-02

    申请号:US10152032

    申请日:2002-05-22

    IPC分类号: H01R1315

    CPC分类号: H05K7/1007

    摘要: A plurality of contact terminals include movable contact portions disposed slantingly oppositely to each other, and the movable contact portion of the contact terminal is disposed movably up to the neighborhood of a position adjacent to the movable contact portion of the adjacent contact terminal. In this situation, when the electrode of the semiconductor device is released from the contact terminal, the electrode is pressed by the back of the movable contact portion in the direction where the electrode is separated from the movable contact portion.

    Socket for semiconductor device
    14.
    发明授权
    Socket for semiconductor device 有权
    半导体器件插座

    公开(公告)号:US07278868B2

    公开(公告)日:2007-10-09

    申请号:US11448900

    申请日:2006-06-08

    申请人: Masaru Sato Ryo Ujike

    发明人: Masaru Sato Ryo Ujike

    IPC分类号: H01R13/15

    摘要: Lengths of arms of pressing members held at a lower end of an arm section of a cover member are determined in correspondence to the retention of semiconductor devices having contour dimensions different from each other, and are shorter than a length of the arm section so that part of the pressing members is projected outside through a recess of the socket body.

    摘要翻译: 保持在盖构件的臂部的下端的按压构件的臂的长度对应于具有彼此不同的轮廓尺寸的半导体器件的保持来确定,并且比臂部的长度短,从而部分 的按压构件通过插座主体的凹部突出到外部。