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公开(公告)号:US07230830B2
公开(公告)日:2007-06-12
申请号:US11106461
申请日:2005-04-15
申请人: Ryo Ujike , Takahiro Oikawa , Katsumi Suzuki , Eiji Kobori , Eisaku Tsubota
发明人: Ryo Ujike , Takahiro Oikawa , Katsumi Suzuki , Eiji Kobori , Eisaku Tsubota
CPC分类号: G01R1/0458 , H01L23/4093 , H01L2224/73253
摘要: In a state wherein front ends of latch members 18A and 18B are apart from each other so that the upper surface of an alignment plate/positioning member 24 is outside, a pressing section 12PU of a heat sink member 12 is brought into contact with the periphery of a semiconductor device 22.
摘要翻译: 在闩锁构件18A和18B的前端彼此分开使得对准板/定位构件24的上表面在外部的状态下,散热构件12的按压部分12PU被接触 与半导体器件22的周边。
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公开(公告)号:US20060228916A1
公开(公告)日:2006-10-12
申请号:US11448873
申请日:2006-06-08
申请人: Masaru Sato , Ryo Ujike
发明人: Masaru Sato , Ryo Ujike
IPC分类号: H01R12/00
CPC分类号: G01R1/0466 , G01R1/0483 , G01R31/2863 , H01L23/32 , H01L2924/0002 , H01L2924/00
摘要: Lengths of arms of pressing members held at a lower end of an arm section of a cover member are determined in correspondence to the retention of semiconductor devices having contour dimensions different from each other, and are shorter than a length of the arm section so that part of the pressing members is projected outside through a recess of the socket body.
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公开(公告)号:US06655974B2
公开(公告)日:2003-12-02
申请号:US10152032
申请日:2002-05-22
申请人: Kazunori Nakano , Ryo Ujike , Kenji Ichihara
发明人: Kazunori Nakano , Ryo Ujike , Kenji Ichihara
IPC分类号: H01R1315
CPC分类号: H05K7/1007
摘要: A plurality of contact terminals include movable contact portions disposed slantingly oppositely to each other, and the movable contact portion of the contact terminal is disposed movably up to the neighborhood of a position adjacent to the movable contact portion of the adjacent contact terminal. In this situation, when the electrode of the semiconductor device is released from the contact terminal, the electrode is pressed by the back of the movable contact portion in the direction where the electrode is separated from the movable contact portion.
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公开(公告)号:US07278868B2
公开(公告)日:2007-10-09
申请号:US11448900
申请日:2006-06-08
申请人: Masaru Sato , Ryo Ujike
发明人: Masaru Sato , Ryo Ujike
IPC分类号: H01R13/15
CPC分类号: G01R1/0466 , G01R1/0483 , G01R31/2863 , H01L23/32 , H01L2924/0002 , H01L2924/00
摘要: Lengths of arms of pressing members held at a lower end of an arm section of a cover member are determined in correspondence to the retention of semiconductor devices having contour dimensions different from each other, and are shorter than a length of the arm section so that part of the pressing members is projected outside through a recess of the socket body.
摘要翻译: 保持在盖构件的臂部的下端的按压构件的臂的长度对应于具有彼此不同的轮廓尺寸的半导体器件的保持来确定,并且比臂部的长度短,从而部分 的按压构件通过插座主体的凹部突出到外部。
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公开(公告)号:US07165978B2
公开(公告)日:2007-01-23
申请号:US11448873
申请日:2006-06-08
申请人: Masaru Sato , Ryo Ujike
发明人: Masaru Sato , Ryo Ujike
IPC分类号: H01R12/00
CPC分类号: G01R1/0466 , G01R1/0483 , G01R31/2863 , H01L23/32 , H01L2924/0002 , H01L2924/00
摘要: Lengths of arms of pressing members held at a lower end of an arm section of a cover member are determined in correspondence to the retention of semiconductor devices having contour dimensions different from each other, and are shorter than a length of the arm section so that part of the pressing members is projected outside through a recess of the socket body.
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公开(公告)号:US20060228926A1
公开(公告)日:2006-10-12
申请号:US11448899
申请日:2006-06-08
申请人: Masaru Sato , Ryo Ujike
发明人: Masaru Sato , Ryo Ujike
IPC分类号: H01R13/15
CPC分类号: G01R1/0466 , G01R1/0483 , G01R31/2863 , H01L23/32 , H01L2924/0002 , H01L2924/00
摘要: Lengths of arms of pressing members held at a lower end of an arm section of a cover member are determined in correspondence to the retention of semiconductor devices having contour dimensions different from each other, and are shorter than a length of the arm section so that part of the pressing members is projected outside through a recess of the socket body.
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