公开(公告)号：US20210159403A1

公开(公告)日：2021-05-27

申请号：US17142539

申请日：2021-01-06

Applicant: Texas Instruments Incorporated

Inventor： Ming Li ,  Yiqi Tang ,  Jie Chen ,  Enis Tuncer ,  Usman Mahmood Chaudhry ,  Tony Ray Larson ,  Rajen Manicon Murugan ,  John Paul Tellkamp ,  Satyendra Singh Chauhan

IPC: H01L43/14 ,  H01L43/06 ,  G01R15/20 ,  H01L23/495 ,  G01R33/07

Abstract: A Hall-effect sensor package includes and an IC die including a Hall-Effect element and a leadframe including leads on a first side providing a first field generating current (FGC) path including ≥1 first FGC input pin coupled by a reduced width first curved head over or under the Hall-effect sensor element to ≥1 first FGC output pin, and second leads on a second side of the package. Some leads on the second side are attached to bond pads on the IC die including the output of the Hall-effect element. A clip is attached at one end to the first FGC input pin and at another end to a location on the first FGC output pin, having a reduced width second curved head in between that is over or under the Hall-effect sensor element opposite the first head.

公开(公告)号：US10978239B2

公开(公告)日：2021-04-13

申请号：US15634336

申请日：2017-06-27

Applicant: Texas Instruments Incorporated

Inventor： Haiying Li ,  Benjamin Michael Sutton ,  Ming Li

IPC: H01F5/00 ,  H01F27/28 ,  H01F17/00 ,  H01F17/06 ,  H01F17/04 ,  H01F27/02 ,  H01F41/04 ,  H01F27/32 ,  H01F41/12

Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.

公开(公告)号：US09824811B2

公开(公告)日：2017-11-21

申请号：US14576904

申请日：2014-12-19

Applicant: Texas Instruments Incorporated

Inventor： Haiying Li ,  Benjamin Michael Sutton ,  Ming Li

IPC: H01F5/00 ,  H01F27/28 ,  H01F27/02 ,  H01F41/04 ,  H01F17/00 ,  H01F17/06

CPC classification number: H01F27/2804 ,  H01F17/0033 ,  H01F17/045 ,  H01F17/062 ,  H01F27/022 ,  H01F27/2895 ,  H01F27/327 ,  H01F41/041 ,  H01F41/127 ,  H01F2027/2809 ,  H01F2027/2814

Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.