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公开(公告)号：US10892405B2
公开(公告)日：2021-01-12
申请号：US16404978
申请日：2019-05-07
Applicant: Texas Instruments Incorporated
Inventor： Ming Li , Yiqi Tang , Jie Chen , Enis Tuncer , Usman Mahmood Chaudhry , Tony Ray Larson , Rajen Manicon Murugan , John Paul Tellkamp , Satyendra Singh Chauhan
Abstract: A Hall-effect sensor package includes and an IC die including a Hall-Effect element and a leadframe including leads on a first side providing a first field generating current (FGC) path including ≥1 first FGC input pin coupled by a reduced width first curved head over or under the Hall-effect sensor element to ≥1 first FGC output pin, and second leads on a second side of the package. Some leads on the second side are attached to bond pads on the IC die including the output of the Hall-effect element. A clip is attached at one end to the first FGC input pin and at another end to a location on the first FGC output pin, having a reduced width second curved head in between that is over or under the Hall-effect sensor element opposite the first head.
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公开(公告)号：US20160181004A1
公开(公告)日：2016-06-23
申请号：US14576934
申请日：2014-12-19
Applicant: Texas Instruments Incorporated
Inventor： Haiying Li , Benjamin Michael Sutton , Ming Li
CPC classification number: H01F27/2804 , H01F17/0006 , H01F17/0033 , H01F17/062 , H01F27/022 , H01F27/2895 , H01F41/041 , H01F41/043 , H01F41/127
Abstract: An embodiment of coil assembly includes a laterally disposed ferrite ring having a central opening. A laterally disposed annular conductive member is positioned above the ferrite ring and has a plurality of spaced-apart circumferential segments. A plurality of bond wires are connected at opposite ends thereof to outer and inner portions of the plurality of spaced-apart circumferential segments. A layer of mold compound covers the ferrite ring and the bond wires.
Abstract translation: 线圈组件的实施例包括具有中心开口的横向设置的铁氧体环。 横向设置的环形导电构件位于铁氧体环的上方并且具有多个间隔开的周向段。 多个接合线在其相对端连接到多个间隔开的周向段的外部和内部。 一层模具化合物覆盖铁氧体环和接合线。
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公开(公告)号：US20160181003A1
公开(公告)日：2016-06-23
申请号：US14576904
申请日：2014-12-19
Applicant: Texas Instruments Incorporated
Inventor： Haiying Li , Benjamin Michael Sutton , Ming Li
CPC classification number: H01F27/2804 , H01F17/0033 , H01F17/045 , H01F17/062 , H01F27/022 , H01F27/2895 , H01F27/327 , H01F41/041 , H01F41/127 , H01F2027/2809 , H01F2027/2814
Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.
Abstract translation: 嵌入式线圈组件实施例包括具有环形轴线的铁氧体环。 铁氧体环位于导电金属表面上。 多个分离的间隔开的导电结构在铁氧体环上延伸并且在导电表面的位于铁氧体环的环形轴线的径向外侧的第一区域中并且在导电表面的第二区域中附接到导电金属表面 位于铁氧体环的环形轴线的径向内侧。 封装层覆盖铁氧体环和多个导电结构的至少一部分。
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公开(公告)号：US10256027B2
公开(公告)日：2019-04-09
申请号：US14576934
申请日：2014-12-19
Applicant: Texas Instruments Incorporated
Inventor： Haiying Li , Benjamin Michael Sutton , Ming Li
Abstract: An embodiment of coil assembly includes a laterally disposed ferrite ring having a central opening. A laterally disposed annular conductive member is positioned above the ferrite ring and has a plurality of spaced-apart circumferential segments. A plurality of bond wires are connected at opposite ends thereof to outer and inner portions of the plurality of spaced-apart circumferential segments. A layer of mold compound covers the ferrite ring and the bond wires.
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公开(公告)号：US20170294263A1
公开(公告)日：2017-10-12
申请号：US15634336
申请日：2017-06-27
Applicant: Texas Instruments Incorporated
Inventor： Haiying Li , Benjamin Michael Sutton , Ming Li
CPC classification number: H01F27/2804 , H01F17/0033 , H01F17/045 , H01F17/062 , H01F27/022 , H01F27/2895 , H01F27/327 , H01F41/041 , H01F41/127 , H01F2027/2809 , H01F2027/2814
Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.
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Patent Agency Ranking
公开(公告)号：US12021019B2
公开(公告)日：2024-06-25
申请号：US17515176
申请日：2021-10-29
Applicant: Texas Instruments Incorporated
Inventor： Anindya Poddar , Ashok Surendra Prabhu , Edgar Dorotyao Balidoy , Hau Nguyen , Makoto Yoshino , Ming Li
IPC: H01L23/498 , H01L21/48 , H01L21/56 , H01L23/00 , H05K1/02
CPC classification number: H01L23/49861 , H01L21/4839 , H01L21/565 , H01L23/49844 , H01L24/48 , H05K1/0204 , H01L2224/48177 , H01L2224/48178 , H01L2224/48248 , H01L2224/48465 , H01L2924/1811 , H01L2924/182
Abstract: A described example includes: a package substrate having a die pad with a die side surface and having an opposite backside surface, having leads arranged along two opposite sides and having die pad straps extending from two opposing ends of the die pad. The leads lie in a first plane, a portion of the die pad straps lie in a second plane that is spaced from the first plane and located closer to the die pad, and the die pad lies in a third plane that is spaced from and parallel to the second plane in a direction away from the first plane. A semiconductor die is mounted to the die side surface and mold compound covers the semiconductor die, a portion of the leads, and the die side surface of the die pad, and the backside surface of the die pad exposed from the mold compound.
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公开(公告)号：US11557722B2
公开(公告)日：2023-01-17
申请号：US17142539
申请日：2021-01-06
Applicant: Texas Instruments Incorporated
Inventor： Ming Li , Yiqi Tang , Jie Chen , Enis Tuncer , Usman Mahmood Chaudhry , Tony Ray Larson , Rajen Manicon Murugan , John Paul Tellkamp , Satyendra Singh Chauhan
Abstract: A Hall-effect sensor package includes and an IC die including a Hall-Effect element and a leadframe including leads on a first side providing a first field generating current (FGC) path including≥1 first FGC input pin coupled by a reduced width first curved head over or under the Hall-effect sensor element to ≥1 first FGC output pin, and second leads on a second side of the package. Some leads on the second side are attached to bond pads on the IC die including the output of the Hall-effect element. A clip is attached at one end to the first FGC input pin and at another end to a location on the first FGC output pin, having a reduced width second curved head in between that is over or under the Hall-effect sensor element opposite the first head.
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公开(公告)号：US10854370B2
公开(公告)日：2020-12-01
申请号：US15809750
申请日：2017-11-10
Applicant: Texas Instruments Incorporated
Inventor： Haiying Li , Benjamin Michael Sutton , Ming Li
Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.
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公开(公告)号：US20180336994A1
公开(公告)日：2018-11-22
申请号：US15809750
申请日：2017-11-10
Applicant: Texas Instruments Incorporated
Inventor： Haiying Li , Benjamin Michael Sutton , Ming Li
CPC classification number: H01F27/2804 , H01F17/0033 , H01F17/045 , H01F17/062 , H01F27/022 , H01F27/2895 , H01F27/327 , H01F41/041 , H01F41/127 , H01F2027/2809 , H01F2027/2814
Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.
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10.发明申请公开(公告)号：US20170347490A1
公开(公告)日：2017-11-30
申请号：US15162888
申请日：2016-05-24
Inventor： Matthew David Romig , Robert Clair Keller , Ming Li , Yiqi Tang
CPC classification number: H05K7/20418 , H01Q1/02 , H01Q1/2283 , H01Q21/061 , H05K1/0204 , H05K7/20509 , H05K13/00 , H05K2201/066
Abstract: A heat dissipating antenna comprised of a low-attenuating heat spreader bonded to a high frequency antenna or antenna array.An integrated circuit with a wireless integrated circuit chip, and a heat dissipating antenna coupled to the wireless integrated circuit chip. A method of forming a heat dissipating antenna.
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