公开(公告)号：US11764040B2

公开(公告)日：2023-09-19

申请号：US16778071

申请日：2020-01-31

Applicant: Tokyo Electron Limited

Inventor： Michishige Saito ,  Shota Kaneko

IPC: H01J37/32 ,  F28F1/40 ,  H01L21/683

CPC classification number: H01J37/32724 ,  F28F1/40 ,  H01L21/6833

Abstract: A placing table, on which a substrate is placed, includes a base. The base includes a first path configured to allow a heat transfer medium having a first temperature to flow therein; a first heat insulating layer disposed under the first path; and a seal member disposed under the first heat insulating layer.