公开(公告)号：US20220375799A1

公开(公告)日：2022-11-24

申请号：US17664486

申请日：2022-05-23

Applicant: Tokyo Electron Limited

Inventor： Tetsuya Maki ,  Tatsumi Oonishi ,  Toshifumi Inamasu

IPC: H01L21/66 ,  H01L23/00

Abstract: A bonding apparatus includes a first holder, a second holder, a first interferometer, a housing, a gas supply and an airflow control cover. The first holder attracts and holds the first substrate. The second holder attracts and holds the second substrate. The first interferometer measures, by radiating light to the second holder or a first object which is moved along with the second holder in the first horizontal direction, a distance to the second holder or the first object in the first horizontal direction. The housing accommodates therein the first holder, the second holder and the first interferometer. The gas supply is provided at a lateral side of the housing, and supplies a gas into the housing. The airflow control cover is provided within the housing, and redirects a part of a flow of the gas supplied from the gas supply toward a first path of the light.