公开(公告)号：US20090059520A1

公开(公告)日：2009-03-05

申请号：US12068297

申请日：2008-02-05

申请人： Shigeaki Tanaka ,  Yoshikatsu Kasahara

发明人： Shigeaki Tanaka ,  Yoshikatsu Kasahara

IPC分类号： H05K7/20

CPC分类号： G11B33/142 ,  H05K7/20727

摘要： According to the storage control device of the present invention, individual cooling passages are formed for each region in the enclosure and the respective cooling passages are formed bent so as to bypass the connection substrate. As a result, the interior of the enclosure is cooled efficiently. The interior of the enclosure is divided in the front-rear direction by the connection substrate. Logic substrates and battery devices are provided on the front side of the connection substrate and logic substrates and power supply devices are provided on the rear side of the connection substrate. The battery devices and power supply devices located on the left and right sides of the enclosure are each cooled by means of individual cooling passages. The logic substrates are cooled by means of different cooling passages.

摘要翻译： 根据本发明的存储控制装置，对于外壳中的每个区域形成单独的冷却通道，并且相应的冷却通道弯曲形成以绕过连接基板。 结果，外壳的内部被有效地冷却。 外壳的内部通过连接基板沿前后方向分开。 逻辑基板和电池装置设置在连接基板的前侧，逻辑基板和电源装置设置在连接基板的后侧。 位于外壳左侧和右侧的电池装置和电源装置均通过单独的冷却通道进行冷却。 逻辑基板通过不同的冷却通道进行冷却。

公开(公告)号：USD690694S1

公开(公告)日：2013-10-01

申请号：US29398958

申请日：2011-08-08

申请人： Toshiyuki Utsuki ,  Sayuri Hashizume ,  Koichi Umezawa ,  Kenta Kumagai ,  Chikazu Yokoi ,  Yoshikatsu Kasahara

设计人： Toshiyuki Utsuki ,  Sayuri Hashizume ,  Koichi Umezawa ,  Kenta Kumagai ,  Chikazu Yokoi ,  Yoshikatsu Kasahara

公开(公告)号：US20100172078A1

公开(公告)日：2010-07-08

申请号：US12659520

申请日：2010-03-11

申请人： Shigeaki Tanaka ,  Yoshikatsu Kasahara

发明人： Shigeaki Tanaka ,  Yoshikatsu Kasahara

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： G11B33/142 ,  H05K7/20727

摘要： According to the storage control device of the present invention, individual cooling passages are formed for each region in the enclosure and the respective cooling passages are formed bent so as to bypass the connection substrate. As a result, the interior of the enclosure is cooled efficiently. The interior of the enclosure is divided in the front-rear direction by the connection substrate. Logic substrates and battery devices are provided on the front side of the connection substrate and logic substrates and power supply devices are provided on the rear side of the connection substrate. The battery devices and power supply devices located on the left and right sides of the enclosure are each cooled by means of individual cooling passages. The logic substrates are cooled by means of different cooling passages.

公开(公告)号：US07701710B2

公开(公告)日：2010-04-20

申请号：US12068297

申请日：2008-02-05

申请人： Shigeaki Tanaka ,  Yoshikatsu Kasahara

发明人： Shigeaki Tanaka ,  Yoshikatsu Kasahara

IPC分类号： H05K7/00 ,  H05K5/00 ,  G06F1/20

CPC分类号： G11B33/142 ,  H05K7/20727

摘要： According to the storage control device of the present invention, individual cooling passages are formed for each region in the enclosure and the respective cooling passages are formed bent so as to bypass the connection substrate. As a result, the interior of the enclosure is cooled efficiently. The interior of the enclosure is divided in the front-rear direction by the connection substrate. Logic substrates and battery devices are provided on the front side of the connection substrate and logic substrates and power supply devices are provided on the rear side of the connection substrate. The battery devices and power supply devices located on the left and right sides of the enclosure are each cooled by means of individual cooling passages. The logic substrates are cooled by means of different cooling passages.

摘要翻译： 根据本发明的存储控制装置，对于外壳中的每个区域形成单独的冷却通道，并且各个冷却通道弯曲形成以绕过连接基板。 结果，外壳的内部被有效地冷却。 外壳的内部通过连接基板沿前后方向分开。 逻辑基板和电池装置设置在连接基板的前侧，逻辑基板和电源装置设置在连接基板的后侧。 位于外壳左侧和右侧的电池装置和电源装置均通过单独的冷却通道进行冷却。 逻辑基板通过不同的冷却通道进行冷却。

公开(公告)号：USD650383S1

公开(公告)日：2011-12-13

申请号：US29361213

申请日：2010-05-07

申请人： Toshiyuki Utsuki ,  Sayuri Hashizume ,  Kenta Kumagai ,  Toshihiko Wada ,  Yasuji Morishita ,  Yoshikatsu Kasahara

设计人： Toshiyuki Utsuki ,  Sayuri Hashizume ,  Kenta Kumagai ,  Toshihiko Wada ,  Yasuji Morishita ,  Yoshikatsu Kasahara

公开(公告)号：US07933120B2

公开(公告)日：2011-04-26

申请号：US12659520

申请日：2010-03-11

申请人： Shigeaki Tanaka ,  Yoshikatsu Kasahara

发明人： Shigeaki Tanaka ,  Yoshikatsu Kasahara

IPC分类号： G06F1/20 ,  H05K7/20 ,  H05K5/00

CPC分类号： G11B33/142 ,  H05K7/20727

摘要： According to the storage control device of the present invention, individual cooling passages are formed for each region in the enclosure and the respective cooling passages are formed bent so as to bypass the connection substrate. As a result, the interior of the enclosure is cooled efficiently. The interior of the enclosure is divided in the front-rear direction by the connection substrate. Logic substrates and battery devices are provided on the front side of the connection substrate and logic substrates and power supply devices are provided on the rear side of the connection substrate. The battery devices and power supply devices located on the left and right sides of the enclosure are each cooled by means of individual cooling passages. The logic substrates are cooled by means of different cooling passages.

摘要翻译： 根据本发明的存储控制装置，对于外壳中的每个区域形成单独的冷却通道，并且各个冷却通道弯曲形成以绕过连接基板。 结果，外壳的内部被有效地冷却。 外壳的内部通过连接基板沿前后方向分开。 逻辑基板和电池装置设置在连接基板的前侧，逻辑基板和电源装置设置在连接基板的后侧。 位于外壳左侧和右侧的电池装置和电源装置均通过单独的冷却通道进行冷却。 逻辑基板通过不同的冷却通道进行冷却。