公开(公告)号：US06884938B2

公开(公告)日：2005-04-26

申请号：US10706064

申请日：2003-11-12

申请人： Toru Aoyagi

发明人： Toru Aoyagi

IPC分类号： H01L25/18 ,  H01L23/02 ,  H01L25/04 ,  H05K1/00 ,  H05K1/03 ,  H05K1/14 ,  H05K1/18 ,  H05K9/00

CPC分类号： H05K1/144 ,  H01L2924/3025 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/183

摘要： A circuit module includes an insulating base including a first wiring pattern and a cavity; at least one first electrical component disposed in the cavity; and a lid including a second wiring pattern. The insulating base includes a circuit board composed of laminated substrates and a sidewall protruding from the board surface of the circuit board and forming the cavity together with the circuit board, and the lid has at least one second electrical component fixed thereto. Also, in a state in which the second electrical component is located in the cavity, the lid is fixed on the upper surface of the sidewall so as to cover the cavity, and the first and second wiring patterns are connected to each other with at least one connecting conductor.

摘要翻译： 电路模块包括：绝缘基座，包括第一布线图案和空腔; 设置在所述空腔中的至少一个第一电气部件; 以及包括第二布线图案的盖。 绝缘基座包括由叠层基板和从电路板的板表面突出并且与电路板一起形成空腔的侧壁的电路板，并且盖具有固定到其上的至少一个第二电气部件。 此外，在第二电气部件位于空腔中的状态下，盖子固定在侧壁的上表面上以覆盖空腔，并且第一和第二布线图案至少连接到彼此 一个连接导体。