公开(公告)号：US20140174791A1

公开(公告)日：2014-06-26

申请号：US13726659

申请日：2012-12-26

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Cheng-Po Yu ,  Han-Pei Huang ,  Shang-Feng Huang

IPC: H05K3/06 ,  H05K1/02

CPC classification number: H05K3/465 ,  H05K3/06 ,  H05K3/108 ,  H05K2203/0723

Abstract: A circuit board and a manufacturing method thereof are provided. A dielectric layer is formed on a substrate, wherein an internal circuit layer is formed on the substrate and the dielectric layer covers the internal circuit layer. A first trench, a second trench and an opening are formed in the dielectric layer. The opening is located below the first trench and connected with the first trench, and a portion of the internal circuit layer is exposed by the opening. A patterned conductive layer is formed on the dielectric layer. The patterned conductive layer covers a portion of the dielectric layer and fills the first trench, the second trench and the opening so as to form a first circuit layer, a second circuit layer and a conductive through via, respectively, wherein the conductive through via is electrically connected with the first circuit layer and the internal circuit layer.

Abstract translation: 提供一种电路板及其制造方法。 在基板上形成电介质层，在基板上形成内部电路层，电介质层覆盖内部电路层。 在电介质层中形成第一沟槽，第二沟槽和开口。 开口位于第一沟槽的下方并与第一沟槽连接，内部电路层的一部分被开口露出。 在电介质层上形成有图案的导电层。 图案化的导电层覆盖电介质层的一部分并且填充第一沟槽，第二沟槽和开口，以分别形成第一电路层，第二电路层和导电通孔，其中导电通孔是 与第一电路层和内部电路层电连接。