公开(公告)号：US20150214125A1

公开(公告)日：2015-07-30

申请号：US14164282

申请日：2014-01-27

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Kuang-Hui Tang

IPC: H01L21/66

CPC classification number: H01L22/34

Abstract: A scribe line structure including a semiconductor substrate, a pad and a first patterned metal layer is provided. The semiconductor substrate has a die region, a die sealing region located outside the die region and a dicing region located outside the die sealing region. The pad is disposed in the dicing region. The first patterned metal layer is disposed in the dicing region, right below and connected to the pad, wherein the first patterned metal layer has a plurality of first patterns directly connected to each other.

Abstract translation: 提供了包括半导体衬底，焊盘和第一图案化金属层的划线结构。 半导体基板具有管芯区域，位于管芯区域外的管芯密封区域和位于管芯密封区域外的切割区域。 焊盘设置在切割区域中。 第一图案化金属层设置在切割区域的正下方并连接到焊盘，其中第一图案化金属层具有彼此直接连接的多个第一图案。