公开(公告)号：US11063010B2

公开(公告)日：2021-07-13

申请号：US16264684

申请日：2019-02-01

Applicant: Winbond Electronics Corp.

Inventor： Yen-Jui Chu ,  Jin-Neng Wu ,  Hsin-Hung Chou ,  Chun-Hung Lin

IPC: H01L23/00

Abstract: Provided is a redistribution layer (RDL) structure including a substrate, a pad, a dielectric layer, a self-aligned structure, a conductive layer, and a conductive connector. The pad is disposed on the substrate. The dielectric layer is disposed on the substrate and exposes a portion of the pad. The self-aligned structure is disposed on the dielectric layer. The conductive layer extends from the pad to conformally cover a surface of the self-aligned structure. The conductive connector is disposed on the self-aligned structure. A method of manufacturing the RDL structure is also provided.