摘要:
A high voltage device. A high voltage MOS transistor is applied in the ESD protection device to the structure of which a doped region is added, generating a parasitic semiconductor controlled rectifier (SCR) having a shorter discharge path such that the SCR has faster response enhancing ESD protection.
摘要:
An ESD protection circuit coupled between a first power line and a second power line to avoid damage to an integrated circuit by an ESD event is disclosed. The ESD protection circuit includes a detection unit, a trigger unit, and a discharging unit. The detection unit asserts a detection signal when the ESD event occurs. The trigger unit asserts a first trigger signal and a second trigger signal when the detection is asserted. The discharging unit provides a discharge path to release an ESD current caused by the ESD event when the first and the second trigger signals are asserted.
摘要:
An electrostatic discharge (ESD) protection circuit is provided. A transistor is coupled between a node and a ground, and has a gate coupled to the ground. A diode chain is coupled between the node and a pad, and comprises a plurality of first diodes connected in series, wherein the first diode is coupled in a forward conduction direction from the pad to the node. A second diode is coupled between the node and the pad, and the second diode is coupled in a forward conduction direction from the node to the pad.
摘要:
An electrostatic discharge (ESD) protection device is provided. The ESD protection device includes an epitaxy layer disposed on a semiconductor substrate. An isolation pattern is disposed on the epitaxy layer to define a first active region and a second active region, which are surrounded by a first well region. A gate is disposed on the isolation pattern. A first doped region and a second doped region are disposed in the first active region and the second active region, respectively. A drain doped region is disposed in the first doped region. A source doped region and a first pick-up doped region are disposed in the second doped region. A source contact plug having an extended portion connects to the source doped region. A ratio of an area of the extended portion covering the first pick-up doped region to an area of first pick-up doped region is between zero and one.
摘要:
Insulated gate bipolar transistor (IGBT) electrostatic discharge (ESD) protection devices are presented. An IGBT-ESD device includes a semiconductor substrate and patterned insulation regions disposed on the semiconductor substrate defining a first active region and a second active region. A high-V N-well is formed in the first active region of the semiconductor substrate. A P-body doped region is formed in the second active region of the semiconductor substrate, wherein the high-V N-well and the P-body doped region are separated with a predetermined distance exposing the semiconductor substrate. A P+ doped drain region is disposed in the high-V N-well. A P+ diffused region and an N+ doped source region are disposed in the P-body doped region. A gate structure is disposed on the semiconductor substrate with one end adjacent to the N+ doped source region and the other end extending over the insulation region.
摘要翻译:介绍了绝缘栅双极晶体管(IGBT)静电放电(ESD)保护装置。 IGBT-ESD器件包括半导体衬底和设置在半导体衬底上的图案化绝缘区域,其限定第一有源区域和第二有源区域。 在半导体衬底的第一有源区中形成高V N阱。 在半导体衬底的第二有源区中形成P体掺杂区域,其中高V N阱和P体掺杂区域以暴露半导体衬底的预定距离被分离。 P +掺杂漏区设置在高V N阱中。 P +扩散区域和N +掺杂源极区域设置在P体掺杂区域中。 栅极结构设置在半导体衬底上,其一端与N +掺杂源极区相邻,另一端延伸在绝缘区上。
摘要:
Insulated gate bipolar transistor (IGBT) electrostatic discharge (ESD) protection devices are presented. An IGBT-ESD device includes a semiconductor substrate and patterned insulation regions disposed on the semiconductor substrate defining a first active region and a second active region. A high-V N-well is formed in the first active region of the semiconductor substrate. A P-body doped region is formed in the second active region of the semiconductor substrate, wherein the high-V N-well and the P-body doped region are separated with a predetermined distance exposing the semiconductor substrate. A P+ doped drain region is disposed in the high-V N-well. A P+ diffused region and an N+ doped source region are disposed in the P-body doped region. A gate structure is disposed on the semiconductor substrate with one end adjacent to the N+ doped source region and the other end extending over the insulation region.
摘要翻译:介绍了绝缘栅双极晶体管(IGBT)静电放电(ESD)保护装置。 IGBT-ESD器件包括半导体衬底和设置在半导体衬底上的图案化绝缘区域,其限定第一有源区域和第二有源区域。 在半导体衬底的第一有源区中形成高V N阱。 在半导体衬底的第二有源区中形成P体掺杂区域,其中高V N阱和P体掺杂区域以暴露半导体衬底的预定距离被分离。 P +掺杂漏区设置在高V N阱中。 P +扩散区域和N +掺杂源极区域设置在P体掺杂区域中。 栅极结构设置在半导体衬底上,其一端与N +掺杂源极区相邻,另一端延伸在绝缘区上。
摘要:
A semiconductor device is described. The semiconductor device comprises a protected device in a protected device area of a substrate. An electrostatic discharge power clamp device comprising an outer first guard ring and an inner second guard ring is in a guard ring area of the substrate, enclosing the protected device. The first guard ring comprises a first well region having a first conductive type. A first doped region having the first conductive type and a second doped region having a second conductive type are in the first well region. The second guard ring comprises a second well region having a second conductive type. A third doped region has the second conductive type in the second well region. An input/output device is in a periphery device area, coupled to the electrostatic discharge power clamp device.
摘要:
Insulated gate bipolar transistor (IGBT) electrostatic discharge (ESD) protection devices are presented. An IGBT-ESD device includes a semiconductor substrate and patterned insulation regions disposed on the semiconductor substrate defining a first active region and a second active region. A high-V N-well is formed in the first active region of the semiconductor substrate. A P-body doped region is formed in the second active region of the semiconductor substrate, wherein the high-V N-well and the P-body doped region are separated with a predetermined distance exposing the semiconductor substrate. A P+ doped drain region is disposed in the high-V N-well. A P+ diffused region and an N+ doped source region are disposed in the P-body doped region. A gate structure is disposed on the semiconductor substrate with one end adjacent to the N+ doped source region and the other end extending over the insulation region.
摘要翻译:介绍了绝缘栅双极晶体管(IGBT)静电放电(ESD)保护装置。 IGBT-ESD器件包括半导体衬底和设置在半导体衬底上的图案化绝缘区域,其限定第一有源区域和第二有源区域。 在半导体衬底的第一有源区中形成高V N阱。 在半导体衬底的第二有源区中形成P体掺杂区域,其中高V N阱和P体掺杂区域以暴露半导体衬底的预定距离被分离。 P +掺杂漏区设置在高V N阱中。 P +扩散区域和N +掺杂源极区域设置在P体掺杂区域中。 栅极结构设置在半导体衬底上,其一端与N +掺杂源极区相邻,另一端延伸在绝缘区上。
摘要:
Insulated gate bipolar transistor (IGBT) electrostatic discharge (ESD) protection devices are presented. An IGBT-ESD device includes a semiconductor substrate and patterned insulation regions disposed on the semiconductor substrate defining a first active region and a second active region. A high-V N-well is formed in the first active region of the semiconductor substrate. A P-body doped region is formed in the second active region of the semiconductor substrate, wherein the high-V N-well and the P-body doped region are separated with a predetermined distance exposing the semiconductor substrate. A P+ doped drain region is disposed in the high-V N-well. A P+ diffused region and an N+ doped source region are disposed in the P-body doped region. A gate structure is disposed on the semiconductor substrate with one end adjacent to the N+ doped source region and the other end extending over the insulation region.
摘要翻译:介绍了绝缘栅双极晶体管(IGBT)静电放电(ESD)保护装置。 IGBT-ESD器件包括半导体衬底和设置在半导体衬底上的图案化绝缘区域,其限定第一有源区域和第二有源区域。 在半导体衬底的第一有源区中形成高V N阱。 在半导体衬底的第二有源区中形成P体掺杂区域,其中高V N阱和P体掺杂区域以暴露半导体衬底的预定距离被分离。 P +掺杂漏区设置在高V N阱中。 P +扩散区域和N +掺杂源极区域设置在P体掺杂区域中。 栅极结构设置在半导体衬底上,其一端与N +掺杂源极区相邻,另一端延伸在绝缘区上。
摘要:
An electrostatic discharge (ESD) protection circuit is provided. A transistor is coupled between a node and a ground, and has a gate coupled to the ground. A diode chain is coupled between the node and a pad, and comprises a plurality of first diodes connected in series, wherein the first diode is coupled in a forward conduction direction from the pad to the node. A second diode is coupled between the node and the pad, and the second diode is coupled in a forward conduction direction from the node to the pad.