Abstract:
A flexible fingerprint sensor laminate comprising: a layer of flexible substrate having a front surface and a back surface, at least a domain of electrically conductive material deposited on the front surface, a protective hard coating layer that covers the domain of electrically conductive material, and a plurality of sensor electrodes deposited preferably on the back surface and related circuitry (e.g. integrated circuit for driving and sensing). Preferably, the layer of flexible substrate is no greater than 20 μm in thickness, the domain of electrically conductive material has a thickness no greater than 2 μm, the protective hard coating has a thickness no greater than 1 μm, and the laminate has a surface sheet resistance no greater than 200 Ohm per square and surface scratch resistance no less than 3 H. The laminate exhibits good scratch resistance, low sheet resistance, good flexibility and mechanical integrity. The invention also provides a biometric sensor, such as a fingerprint sensor. The invention further provides a process for producing such a sensor laminate.
Abstract:
An integrated heat sink article composed of a heat collection member and at least one heat dissipation member integral to the heat collection member, wherein the heat collection member is configured to be in thermal contact with a heat source, collects heat from the heat source, and dissipates heat through the at least one heat dissipation member, and further wherein the heat sink is formed of a nano graphene platelet-reinforced composite having nano graphene platelets or sheets (NGPs) as a first reinforcement phase dispersed in a matrix material and the first reinforcement phase occupies a weight fraction of 1-90% based on the total composite weight. Preferably, these NGPs, alone or in combination with a second reinforcement phase, are bonded by an adhesive and constitute a continuous 3-D network of electron- and phonon-conducting paths.