DECOUPLING DEVICE AND FABRICATING METHOD THEREOF
    21.
    发明申请
    DECOUPLING DEVICE AND FABRICATING METHOD THEREOF 有权
    解除装置及其制作方法

    公开(公告)号:US20130120903A1

    公开(公告)日:2013-05-16

    申请号:US13350813

    申请日:2012-01-15

    CPC classification number: H01G9/048 H01G9/08 H01G9/15 H01G9/26 Y10T29/417

    Abstract: A decoupling device including a lead frame, multiple capacitor units, a protective layer and a packaging element is provided. The lead frame includes a cathode terminal portion and at least two opposite anode terminal portions disposed at two ends of the cathode terminal portion. The two anode terminal portions are electrically connected with each other through a conductive line. The capacitor units are connected in parallel and disposed on the lead frame. Each capacitor unit has a cathode portion and an opposite anode portion. The cathode portion is electrically connected with the cathode terminal portion. The anode portion is electrically connected with the anode terminal portion. The protective layer wraps at least one of the anode portion and the cathode portion of the capacitor unit. The packaging element covers the lead frame, the capacitor units and the protective layer. The packaging element exposes a bottom surface of the lead frame.

    Abstract translation: 提供一种包括引线框,多个电容器单元,保护层和封装元件的去耦装置。 引线框架包括阴极端子部分和设置在阴极端子部分的两端的至少两个相对的阳极端子部分。 两个阳极端子部分通过导线彼此电连接。 电容器单元并联连接并设置在引线框架上。 每个电容器单元具有阴极部分和相对的阳极部分。 阴极部分与阴极端子部电连接。 阳极部与阳极端子部电连接。 保护层包裹电容器单元的阳极部分和阴极部分中的至少一个。 封装元件覆盖引线框架,电容器单元和保护层。 包装元件暴露引线框架的底表面。

    Through hole capacitor and method of manufacturing the same
    23.
    发明授权
    Through hole capacitor and method of manufacturing the same 有权
    通孔电容器及其制造方法

    公开(公告)号:US07894178B2

    公开(公告)日:2011-02-22

    申请号:US12046422

    申请日:2008-03-11

    Abstract: A through hole capacitor at least including a substrate, an anode layer, a dielectric layer, a first cathode layer, and a second cathode layer is provided. The substrate has a plurality of through holes. The anode layer is disposed on the inner surface of at least one through hole, and the surface of the anode layer is a porous structure. The dielectric layer is disposed on the porous structure of the anode layer. The first cathode layer covers a surface of the dielectric layer. The second cathode layer covers a surface of the first cathode layer, and the conductivity of the second cathode layer is greater than that of the first cathode layer. The through hole capacitor can be used for impedance control, as the cathode layers of the through hole are used for signal transmission.

    Abstract translation: 提供至少包括基板,阳极层,电介质层,第一阴极层和第二阴极层的通孔电容器。 基板具有多个通孔。 阳极层设置在至少一个通孔的内表面上,阳极层的表面是多孔结构。 电介质层设置在阳极层的多孔结构上。 第一阴极层覆盖电介质层的表面。 第二阴极层覆盖第一阴极层的表面,第二阴极层的导电性大于第一阴极层的导电率。 通孔电容器可用于阻抗控制,因为通孔的阴极层用于信号传输。

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