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    Packaging of Roll-type Electrolytic Capacitor Elements
    2.
    发明公开
    Packaging of Roll-type Electrolytic Capacitor Elements 审中-公开

    公开(公告)号：US20240304394A1

    公开(公告)日：2024-09-12

    申请号：US18445743

    申请日：2024-01-12

    Applicant: Yu-Peng Chung ,  Chia-Wei Li ,  Wen Cheng Hsu ,  En-Ming Chen ,  Che-Chih Tsao

    Inventor： Yu-Peng Chung ,  Chia-Wei Li ,  Wen Cheng Hsu ,  En-Ming Chen ,  Che-Chih Tsao

    IPC: H01G9/00 ,  H01G9/008 ,  H01G9/08

    CPC classification number: H01G9/0029 ,  H01G9/008 ,  H01G9/08

    Abstract: This invention describes a packaging structure for roll-type (wound-type) aluminum conductive polymer capacitor element. Two protective substrates are applied to sandwich a roll-type capacitor element in between with an insulating material surrounding the capacitor element also in between the protective substrates. The protective substrates comprise electrically separated anodic conductive pad and cathodic conductive pad on their surfaces. The capacitor element is oriented with its axis perpendicular to the two substrates. The anodic and cathodic leads of the capacitor element pass through the through holes. An anodic external terminal is plated over the anodic conductive pad and a cathodic external terminal is plated over the cathodic conductive pad so that the anodic external terminal is electrically connected to the anodic lead and the cathodic external terminal is electrically connected to the cathodic lead. In another arrangement, the anodic and cathodic leads are bent by about 90 degree so that they point to the two sides of the packaging. External terminals are placed on the two sides of the packaging on the surfaces of the insulating material. In still another arrangement, the packaging structure uses only one protective substrate.

    Packaging structures for electronic elements and solid electrolytic capacitor elements and methods thereof
    4.
    发明授权
    Packaging structures for electronic elements and solid electrolytic capacitor elements and methods thereof 有权

    公开(公告)号：US12057274B2

    公开(公告)日：2024-08-06

    申请号：US17667568

    申请日：2022-02-09

    Applicant: Yu-Peng Chung ,  Chia-Wei Li ,  Che-Chih Tsao

    Inventor： Yu-Peng Chung ,  Chia-Wei Li ,  Che-Chih Tsao

    IPC: H01G9/008 ,  H01G9/08 ,  H01G9/15 ,  H01G9/26

    CPC classification number: H01G9/008 ,  H01G9/08 ,  H01G9/15 ,  H01G9/26

    Abstract: This invention describes packaging structures and methods for electronic devices, especially for solid electrolytic capacitor devices. A packaging structure applies at least two protective substrates to sandwich one or multiple capacitor elements stacked together in between with an insulating material surrounding the capacitor elements also in between the protective substrates. Each protective substrate comprises an anodic conductor pad and a cathodic conductor pad. The anodic conductor pad is electrically connected to an external anode terminal, which is in turn electrically connected to the tip face of the anode end of the capacitor element. The cathodic pad is electrically connected to the cathode of the capacitor element as well as to an external cathode terminal. For quantity production, the basic concept includes sandwiching hundreds of capacitor elements in between large thin protective substrates and bonding them to the conductor pads on the protective substrates; then filling in the insulating material by a capillary filling process; then curing the assembly into a first intermediate assembly. A second intermediate assembly is then made by cutting slots over the first intermediate assembly to expose the anodic and cathodic ends of each capacitor device for subsequent metal depositions to make the external terminals.

    Solid state hard disk casing and solid state hard disk
    5.
    发明授权
    Solid state hard disk casing and solid state hard disk 有权

    公开(公告)号：US11956905B2

    公开(公告)日：2024-04-09

    申请号：US18067383

    申请日：2022-12-16

    Applicant: BEIJING MEMBLAZE TECHNOLOGY CO., LTD

    Inventor： Taile Zhang ,  Guanghua Shangguan

    IPC: H05K5/00 ,  H01G9/08

    CPC classification number: H05K5/0008 ,  H01G9/08 ,  H05K5/0047

    Abstract: A solid state hard disk casing, including: an upper casing and a lower casing fastened to each other, wherein a first lower recess is provided on a side of an inner surface of the lower casing close to one long edge of the lower casing, to accommodate a first portion of one or multiple electrolytic capacitors; a first upper recess is provided on a side of an inner surface of the upper casing close to one long edge of the upper casing, and the first upper recess is opposite to the first lower recess, to accommodate a second portion of the electrolytic capacitor placed in the first lower recess; and a side of the inner surface of the lower casing close to the other long edge of the lower casing is configured to fix a circuit board connected to the electrolytic capacitor.

    Electrolytic capacitor
    8.
    发明授权
    Electrolytic capacitor 有权

    公开(公告)号：US11881360B2

    公开(公告)日：2024-01-23

    申请号：US17687840

    申请日：2022-03-07

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Katsutomo Aritomi

    IPC: H01G9/012 ,  H01G9/15 ,  H01G9/26 ,  H01G9/08

    CPC classification number: H01G9/012 ,  H01G9/15 ,  H01G9/26 ,  H01G9/08

    Abstract: An electrolytic capacitor that includes a resin molded body including a stack that includes a capacitor element with an anode exposed at a first end surface, a dielectric layer on a surface of the anode, and a cathode opposite to the anode and exposed at a second end surface; a first external electrode on the first end surface and electrically connected to the anode; and a second external electrode on the second end surface and electrically connected to the cathode, wherein the first external electrode and the second external electrode each include: a resin electrode layer containing a conductive component and a resin component; and a Ni plating layer on a surface of the resin electrode layer, wherein a ratio of a thickness of the resin electrode layer to a thickness of the Ni plating layer is 5 or less.

    High-voltage feed-through capacitor
    9.
    发明授权
    High-voltage feed-through capacitor 有权

    公开(公告)号：US11862405B2

    公开(公告)日：2024-01-02

    申请号：US18082007

    申请日：2022-12-15

    Applicant: TDK CORPORATION

    Inventor： Yuta Kamo ,  Kenichi Kamehashi ,  Hisashi Tanaka ,  Isao Fujiwara

    IPC: H01G4/35 ,  H01G4/224 ,  H01G9/08 ,  H01G9/10

    CPC classification number: H01G4/35 ,  H01G4/224 ,  H01G9/08 ,  H01G9/10

    Abstract: An element body is formed with a through hole to be open at a first main surface and a second main surface opposing each other. A through-conductor includes a first portion located inside the through hole and a second portion protruding from the second main surface. A case surrounds the element body and is electrically insulating. A cover surrounds the second portion and is electrically insulating. A first resin is contained in the case and coats the element body. A second resin is contained in the cover and is located in a space between an inner surface of the element body and the first portion. The second resin has an electrical resistivity less than an electrical resistivity of the first resin.

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