公开(公告)号：US20070059903A1

公开(公告)日：2007-03-15

申请号：US11514504

申请日：2006-09-01

申请人： Kohei Yano ,  Kouji Akazawa ,  Yoshinori Yoshida ,  Tomohiro Kontani

发明人： Kohei Yano ,  Kouji Akazawa ,  Yoshinori Yoshida ,  Tomohiro Kontani

IPC分类号： H01L21/30

CPC分类号： H01L21/6835 ,  B24B37/30 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/003 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834

摘要： To provide a pressure-sensitive adhesive that is used in processing an article such as a semiconductor wafer, the pressure-sensitive adhesive sheet is one that has a base, an intermediate layer and a pressure-sensitive adhesive layer in order, wherein the intermediate layer has an elastic modulus at elongation at 23° C. of 1 MPa or more and 100 MPa or less, the intermediate layer includes an acrylic polymer obtained by polymerization of a (meth) acrylic monomer mixture containing 1% by weight or more and 20% by weight or less of a nitrogen-containing acrylic monomer, the acrylic polymer containing 20% by weight or less of a polymer component having a molecular weight of 100,000 or less, and the base includes at least one film having an elastic modulus at in tension at 23° C. of 0.6 GPa or more.

摘要翻译： 为了提供用于加工诸如半导体晶片的物品的压敏粘合剂，压敏粘合片是依次具有基底，中间层和压敏粘合剂层的粘合片，其中中间层 在23℃的伸长率下的弹性模量为1MPa以上至100MPa以下，中间层包含通过聚合含有1重量％以上且20重量％以上的（甲基）丙烯酸单体混合物而得到的丙烯酸类聚合物， 以下的含氮丙烯酸类单体，所述丙烯酸类聚合物含有20重量％以下的分子量为100,000以下的聚合物成分，所述基材包括至少一层在拉伸下具有弹性模量的膜 在23℃下为0.6GPa以上。