MICROLENS ARRAY
    1.
    发明申请
    MICROLENS ARRAY 有权
    微阵列

    公开(公告)号:US20100053960A1

    公开(公告)日:2010-03-04

    申请号:US12547136

    申请日:2009-08-25

    IPC分类号: G02B27/10 F21V5/04

    摘要: The present invention provides a microlens array produced by molding a resin obtained by reacting a silicon compound with a boron compound or an aluminum compound, in which the silicon compound is represented by the following formula (I): in which R1 and R2 each independently represent an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group, in which a plurality of R1's are the same or different and a plurality of R2's are the same or different; X represents a hydroxy group, an alkoxy group, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group; and n is 4 to 250. This microlens array has excellent heat resistance and light resistance even when applied to LEDs having an increased power and to LEDs emitting blue light having a short wavelength.

    摘要翻译: 本发明提供一种微透镜阵列,其通过将硅化合物与硼化合物或铝化合物反应而获得的树脂模塑而成,其中硅化合物由下式(I)表示:其中R1和R2各自独立地表示 烷基,环烷基,烯基,炔基或芳基,其中多个R 1相同或不同,并且多个R 2相同或不同; X表示羟基,烷氧基,烷基,环烷基,烯基,炔基或芳基; n为4〜250。这种微透镜阵列即使应用于具有增加的功率的LED以及发射具有短波长的蓝光的LED也具有优异的耐热性和耐光性。

    PROCESS FOR PRODUCING OPTICAL SEMICONDUCTOR DEVICE
    3.
    发明申请
    PROCESS FOR PRODUCING OPTICAL SEMICONDUCTOR DEVICE 有权
    生产光学半导体器件的工艺

    公开(公告)号:US20090061549A1

    公开(公告)日:2009-03-05

    申请号:US12202456

    申请日:2008-09-02

    IPC分类号: H01L21/56 B32B9/04

    摘要: The present invention relates to a process for producing an optical semiconductor device, the process including: disposing a sheet for optical-semiconductor-element encapsulation including a resin sheet A and a plurality of resin layers B discontinuously embedded in the resin sheet A and a plurality of optical semiconductor elements mounted on a substrate in such a way that each of the plurality of optical semiconductor elements faces either one of the plurality of resin layers B; and followed by embedding each of the plurality of optical semiconductor elements in either one of the plurality of resin layers B. According to the process of the invention, optical semiconductor elements can be embedded at once. As a result, an optical semiconductor device which is excellent in LED element protection and durability can be easily obtained. Consequently, the optical semiconductor device obtained can have a prolonged life.

    摘要翻译: 本发明涉及一种光半导体器件的制造方法,该方法包括:将不连续地嵌入树脂片A中的树脂片A和多个树脂层B的光半导体元件封装用片材配置成多个, 以使得所述多个光学半导体元件中的每一个面对所述多个树脂层B中的任一个的方式安装在基板上的光半导体元件; 然后将多个光学半导体元件中的每一个嵌入到多个树脂层B中的任一个中。根据本发明的方法,可以一次嵌入光学半导体元件。 结果,可以容易地获得LED元件保护和耐久性优异的光半导体装置。 因此,获得的光半导体器件可以具有延长的寿命。

    Microlens array
    8.
    发明授权
    Microlens array 有权
    微透镜阵列

    公开(公告)号:US08021756B2

    公开(公告)日:2011-09-20

    申请号:US12547136

    申请日:2009-08-25

    IPC分类号: B32B9/04

    摘要: The present invention provides a microlens array produced by molding a resin obtained by reacting a silicon compound with a boron compound or an aluminum compound, in which the silicon compound is represented by the following formula (I): in which R1 and R2 each independently represent an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group, in which a plurality of R1's are the same or different and a plurality of R2's are the same or different; X represents a hydroxy group, an alkoxy group, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group; and n is 4 to 250. This microlens array has excellent heat resistance and light resistance even when applied to LEDs having an increased power and to LEDs emitting blue light having a short wavelength.

    摘要翻译: 本发明提供一种微透镜阵列,其通过将硅化合物与硼化合物或铝化合物反应而获得的树脂模塑而成,其中硅化合物由下式(I)表示:其中R1和R2各自独立地表示 烷基,环烷基,烯基,炔基或芳基,其中多个R 1相同或不同,多个R 2相同或不同; X表示羟基,烷氧基,烷基,环烷基,烯基,炔基或芳基; n为4〜250。这种微透镜阵列即使应用于具有增加的功率的LED以及发射具有短波长的蓝光的LED也具有优异的耐热性和耐光性。

    MODIFIED POLYALUMINOSILOXANE
    10.
    发明申请
    MODIFIED POLYALUMINOSILOXANE 有权
    改性聚氨酯硅氧烷

    公开(公告)号:US20090227757A1

    公开(公告)日:2009-09-10

    申请号:US12364731

    申请日:2009-02-03

    IPC分类号: C08G77/22

    CPC分类号: C08G77/58 C09D183/14

    摘要: A modified polyaluminosiloxane obtained by treating a polyaluminosiloxane with a silane coupling agent represented by the formula (I): wherein each of R1, R2 and R3 is independently an alkyl group or an alkoxy group; X is a methacryloxy group, a glycidoxy group, an amino group, a vinyl group or a mercapto group, with proviso that at least two of R1, R2 and R3 are alkoxy groups. The photosemiconductor element encapsulating material of the present invention is suitably used for, for example, photosemiconductor devices mounted with blue or white LED elements (backlights for liquid crystal displays, traffic lights, outdoor big displays, advertisement sign boards, and the like).

    摘要翻译: 通过用式(I)表示的硅烷偶联剂处理聚铝硅氧烷获得的改性聚铝硅氧烷:其中R1,R2和R3各自独立地为烷基或烷氧基; X是甲基丙烯酰氧基,缩水甘油氧基,氨基,乙烯基或巯基,条件是R 1,R 2和R 3中的至少两个是烷氧基。 本发明的光半导体元件封装材料适合用于例如安装有蓝色或白色LED元件的光半导体器件(液晶显示器的背光灯,交通灯,户外大显示器,广告牌等)。