-
公开(公告)号:US20100055857A1
公开(公告)日:2010-03-04
申请号:US12334492
申请日:2008-12-14
Applicant: Wei-Chieh Lin , Hsin-Yu Hsu , Hsin-Yen Chiu , Shih-Chieh Hung , Ho-Tai Chen , Jen-Hao Yeh , Li-Cheng Lin
Inventor: Wei-Chieh Lin , Hsin-Yu Hsu , Hsin-Yen Chiu , Shih-Chieh Hung , Ho-Tai Chen , Jen-Hao Yeh , Li-Cheng Lin
IPC: H01L21/336
CPC classification number: H01L29/7813 , H01L21/26586 , H01L29/4236 , H01L29/456 , H01L29/66734
Abstract: A method of forming a power device includes providing a substrate, a semiconductor layer having at least a trench and being disposed on the substrate, a gate insulating layer covering the semiconductor layer, and a conductive material disposed in the trench, performing an ion implantation process to from a body layer, performing a tilted ion implantation process to from a heavy doped region, forming a first dielectric layer overall, performing a chemical mechanical polishing process until the body layer disposed under the heavy doped region is exposed to form source regions on the opposite sides of the trench, and forming a source trace directly covering the source regions disposed on the opposite sides of the trench.
Abstract translation: 一种形成功率器件的方法包括提供衬底,至少具有沟槽并设置在衬底上的半导体层,覆盖半导体层的栅极绝缘层和设置在沟槽中的导电材料,执行离子注入工艺 从体层进行倾斜的离子注入工艺,从重掺杂区域进行倾斜的离子注入工艺,整体形成第一介电层,进行化学机械抛光工艺,直到布置在重掺杂区域之下的体层露出,形成源区 并且形成直接覆盖设置在沟槽的相对侧上的源极区域的源极迹线。