公开(公告)号：US20140268500A1

公开(公告)日：2014-09-18

申请号：US13845168

申请日：2013-03-18

Applicant: APAQ TECHNOLOGY CO., LTD.

Inventor： MING-TSUNG CHEN ,  CHING-FENG LIN

IPC: H01G9/15 ,  H01G9/00

CPC classification number: H01G9/0029 ,  H01G4/232 ,  H01G9/008 ,  H01G9/012 ,  H01G9/10 ,  H01G9/151 ,  Y10T29/417 ,  Y10T29/42

Abstract: A winding-type solid electrolytic capacitor package structure includes a winding capacitor unit, a package body and a conductive unit. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin having a cutting surface, and a negative conductive lead pin having a grinding surface. The conductive unit includes a positive conductive terminal electrically connected to the positive conductive lead pin and a negative conductive terminal electrically connected to the negative conductive lead pin. The positive conductive terminal has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body. The negative conductive terminal has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body. The first and the second exposed portions are extended along the outer surface of the package body.

Abstract translation: 绕组式固体电解电容器封装结构包括绕组电容器单元，封装体和导电单元。 绕组电容器具有由封装体包围的绕组体，具有切割表面的正导电引脚和具有研磨表面的负导电引脚。 导电单元包括电连接到正导电引线引线的正导电端子和电连接到负导电引脚的负导电端子。 正极导电端子具有由封装主体包围的第一嵌入部分和暴露在封装主体外部的第一暴露部分。 负极导电端子具有由封装主体包围的第二嵌入部分和暴露在封装主体外部的第二暴露部分。 第一和第二暴露部分沿包装体的外表面延伸。