公开(公告)号：US20160204558A1

公开(公告)日：2016-07-14

申请号：US15079777

申请日：2016-03-24

Applicant: APPLE INC.

Inventor： Charles B. Woodhull ,  Jason S. Sloey

IPC: H01R24/58 ,  H01R13/50

CPC classification number: H01R24/58 ,  H01R13/50 ,  H01R2105/00 ,  H01R2107/00 ,  H04M1/0274 ,  H05K5/0004

Abstract: Enclosures for electronic devices are provided. These enclosures can be integrally formed with a full or partial receptacle connector shell for receiving electrical connectors such as audio connectors or plugs. For example, an enclosure made from a polymer can be integrally formed with an audio jack shell in an injection molding process. As another example, an enclosure can be integrally formed with one or more full or partial walls of an audio jack shell to form a single piece of polymer or metal and the remaining walls of the audio jack shell can be overmolded or assembled to the polymer or metal walls of the audio jack and proximate portions of the enclosure to form a full or complete audio jack shell.

Abstract translation: 提供电子设备外壳。 这些外壳可以与完全或部分的插座连接器外壳整体形成，用于接收诸如音频连接器或插头的电连接器。 例如，由聚合物制成的外壳可以在注射成型工艺中与音频插座外壳一体形成。 作为另一示例，外壳可以与音频插座外壳的一个或多个全部或部分壁整体形成，以形成单片聚合物或金属，并且音频插座外壳的其余壁可以包覆成型或组装到聚合物或 音频插座的金属壁和外壳的最近部分，以形成完整或完整的音频插孔外壳。