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公开(公告)号：US20170069956A1
公开(公告)日：2017-03-09
申请号：US15233891
申请日：2016-08-10
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Michael B. Wittenberg , Shane Bustle , Duy P. Le
CPC classification number: H01Q1/243 , B29C37/0082 , B29C45/14311 , B29C45/14467 , B29L2031/34 , B29L2031/3437 , G06F1/1626 , G06F1/1633 , G06F1/1656 , G06F2200/1633 , H04M1/0249 , H04M1/0283
Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
Abstract translation: 公开了一种用于电子设备的外壳。 壳体包括第一部件和第二部件，第一部件和第二部件通过间隙与第一部件分离。 壳体还包括第一模制元件，其至少部分地设置在间隙内并且限定互锁特征的至少一部分，以及至少部分地设置在间隙内并机械地接合互锁特征的第二模制元件。 第一部件，第二部件和第二模制部件形成壳体的外表面的一部分。 还公开了一种形成壳体的方法。
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公开(公告)号：US09036916B2
公开(公告)日：2015-05-19
申请号：US13629561
申请日：2012-09-27
Applicant: Apple Inc.
Inventor： Duy P. Le
CPC classification number: G06K9/00577 , G06K2009/0059 , G09C1/00 , H04L9/3278
Abstract: A method of providing a unique identifier for a manufactured part includes defining a boundary area on at least one surface of the manufactured part, recording surface properties within a portion of the boundary area, interpreting the recorded surface properties with a pattern recognition algorithm to create the unique identifier, and storing the unique identifier in a database.
Abstract translation: 提供制造部件的唯一标识符的方法包括在制造部件的至少一个表面上限定边界区域，在边界区域的一部分内记录表面特性，用模式识别算法解释所记录的表面特性以创建 唯一标识符，并将唯一标识符存储在数据库中。
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公开(公告)号：USD1068741S1
公开(公告)日：2025-04-01
申请号：US29936082
申请日：2024-04-05
Applicant: Apple Inc.
Designer： Robert Boyd , Sean Stewart Corbin , Duy P. Le , Guillaume Raoult , Christopher Kuh , Robert Brunner
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公开(公告)号：US20240372245A1
公开(公告)日：2024-11-07
申请号：US18772078
申请日：2024-07-12
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Michael B. Wittenberg , Shane Bustle , Duy P. Le
Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
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公开(公告)号：USD1016782S1
公开(公告)日：2024-03-05
申请号：US29886203
申请日：2023-03-06
Applicant: Apple Inc.
Designer： Christopher Wiita , Robert Boyd , Duy P. Le , Carlos M. Santana
Abstract: FIG. 1 is a front view of earphones showing the claimed design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side view thereof; and,
FIG. 6 is a left side view thereof.
The broken lines in the figures show portions of the earphones that form no part of the claimed design.-
Patent Agency Ranking
公开(公告)号：USD990458S1
公开(公告)日：2023-06-27
申请号：US29853397
申请日：2022-09-15
Applicant: Apple Inc.
Designer： Robert Boyd , Sean Stewart Corbin , Duy P. Le , Guillaume Raoult , Christopher Kuh , Robert Brunner
Abstract: FIG. 1 is a front perspective view of an earphone showing the claimed design;
FIG. 2 is a bottom front perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a top view thereof; and,
FIG. 8 is a bottom view thereof.
The dashed broken lines in the figures show portions of the earphone that form no part of the claimed design.-
公开(公告)号：USD964324S1
公开(公告)日：2022-09-20
申请号：US29825907
申请日：2022-02-07
Applicant: Apple Inc.
Designer： Robert Boyd , Sean Stewart Corbin , Duy P. Le , Guillaume Raoult , Christopher Kuh , Robert Brunner
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公开(公告)号：US20220115770A1
公开(公告)日：2022-04-14
申请号：US17555920
申请日：2021-12-20
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Michael B. Wittenberg , Shane Bustle , Duy P. Le
Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
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公开(公告)号：US11223105B2
公开(公告)日：2022-01-11
申请号：US16740753
申请日：2020-01-13
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Michael B. Wittenberg , Shane Bustle , Duy P. Le
Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
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公开(公告)号：USD916056S1
公开(公告)日：2021-04-13
申请号：US29721503
申请日：2020-01-21
Applicant: Apple Inc.
Designer： Robert Boyd , Sean Stewart Corbin , Duy P. Le , Guillaume Raoult , Christopher Kuh , Robert Brunner
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