公开(公告)号：US20190067207A1

公开(公告)日：2019-02-28

申请号：US15691455

申请日：2017-08-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ian HU

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/36 ,  H01L23/498 ,  H01L21/56 ,  H01L21/48

Abstract: A semiconductor package structure includes a substrate, at least one first semiconductor element, a heat dissipation structure and an insulation layer. The at least one first semiconductor element is attached to the substrate, and has a first surface and a second surface opposite to the first surface. The first surface of the at least one first semiconductor element faces the substrate. The heat dissipation structure is disposed on the second surface of the at least one first semiconductor element. The insulation layer is disposed on the heat dissipation structure, and defines a plurality of openings extending through the insulation layer and exposing a plurality of exposed portions of the heat dissipation structure.