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公开(公告)号:US06483166B2
公开(公告)日:2002-11-19
申请号:US09867486
申请日:2001-05-30
申请人: Alexander Benedix
发明人: Alexander Benedix
IPC分类号: H01L2900
CPC分类号: H01L23/5258 , H01L2224/48091 , H01L2924/00014
摘要: The semiconductor configuration has a packing material that is permeable to radiation energy in a given wavelength band. One or more fuses that adjoin the packing material absorb the energy in the given wavelength band. The fuses are formed of AIIIBV semiconductor material, of titanium silicide, germanium, PbS, InSb, or of SiGe.