公开(公告)号：US20190115274A1

公开(公告)日：2019-04-18

申请号：US16077185

申请日：2017-02-10

Applicant: Apple Inc.

Inventor： Hsin-Hua Hu ,  Jaein Choi ,  James E. Pedder ,  Ion Bita ,  Hairong Tang ,  Chin Wei Hsu ,  Sandeep Chalasani ,  Chih-Lei Chen ,  Sunggu Kang ,  Shinya Ono ,  Jung Yen Huang ,  Lun Tsai

IPC: H01L23/31 ,  H01L23/00 ,  H01L25/075 ,  H01L25/16

Abstract: Micro LED and microdriver chip integration schemes are described. In an embodiment a microdriver chip includes a plurality of trenches formed in a bottom surface of the microdriver chip, with each trench surrounding a conductive stud extending below a bottom surface of the microdriver chip body. Integration schemes are additionally described for providing electrical connection to conductive terminal contacts and micro LEDs bonded to a display substrate and adjacent to a microdriver chip.