公开(公告)号：US09850127B1

公开(公告)日：2017-12-26

申请号：US15669231

申请日：2017-08-04

Applicant: Apple Inc.

Inventor： Milind S. Bhagavat ,  Richard Yeh ,  Henry H. Yang

IPC: H01L21/00 ,  B81C1/00

CPC classification number: B81C1/00825 ,  B81B2203/0118 ,  B81B2207/115

Abstract: In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.