公开(公告)号：US10582631B2

公开(公告)日：2020-03-03

申请号：US15655311

申请日：2017-07-20

申请人： Apple Inc.

发明人： Shravan Bharadwaj

IPC分类号： H05K5/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/10 ,  H05K3/32 ,  G06F1/16 ,  H04M1/18 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46

摘要： A housing made from a circuit laminate includes first and second layers coupled together. Each includes a rigid, electrically insulating non-planar structural layer, flexible conductive traces disposed on surfaces of the structural layer, and flexible connector layers contacting to the flexible conductive traces. The housing may be formed from the circuit laminate using thermoforming or another process that co-molds the first and second layers. The structural layers stiffen the housing and/or form an environmental or other barrier so that the housing protects an internal component.