公开(公告)号：US11238261B2

公开(公告)日：2022-02-01

申请号：US16914673

申请日：2020-06-29

申请人： BOE TECHNOLOGY GROUP CO., LTD.

发明人： Xiufeng Li ,  Haisheng Wang ,  Xiaoliang Ding ,  Pengpeng Wang ,  Yuzhen Guo ,  Lijun Zhao ,  Chenyang Zhang ,  Yaqian Ji ,  Yanling Han ,  Peixiao Li

IPC分类号： G06K9/00 ,  G06F3/041 ,  G06F3/044

摘要： An ultrasonic fingerprint recognition module is described that includes sensing units distributed in the form of array, where the sensing units include: a receiving electrode layer having a plurality of receiving electrodes distributed in the form of array; a piezoelectric material layer disposed on one side of the receiving electrode layer; an emission electrode layer disposed on a side of the piezoelectric material layer distal to the receiving electrode layer, and including a plurality of rows of emission electrodes; a selection circuit having an input terminal which is connected with an excitation signal and an output terminal which is connected with the emission electrode for selecting to transmit the excitation signal to the plurality of emission electrodes; and a pixel receiving circuit connected to the receiving electrode layer that receives a fingerprint signal.