METHOD FOR PACKAGING OLED DEVICE, OLED DISPLAY PANEL AND OLED DISPLAY APPARATUS
    22.
    发明申请
    METHOD FOR PACKAGING OLED DEVICE, OLED DISPLAY PANEL AND OLED DISPLAY APPARATUS 审中-公开
    用于包装OLED器件,OLED显示面板和OLED显示器的方法

    公开(公告)号:US20160254485A1

    公开(公告)日:2016-09-01

    申请号:US14770247

    申请日:2014-09-23

    Inventor: Wenfeng Song

    Abstract: Embodiments of the disclosure provide an OLED display panel, which comprises: a first substrate; a second substrate arranged opposite to the first substrate; and a thermally conductive layer, a first packaging adhesive, a second packaging adhesive and an OLED device between the first substrate and the second substrate, wherein the first packaging adhesive is arranged between the first substrate and the second substrate and encloses a sealed space with the first substrate and the second substrate; the thermally conductive layer is formed within the space enclosed by the first packaging adhesive and includes at least two regions having different conductivities, wherein at least an edge region of the thermally conductive layer has a higher conductivity than a central region of the thermally conductive layer; the second packaging adhesive fills the space enclosed by the first substrate, the second substrate and the first packaging adhesive, and is in contact with a surface of the thermally conductive layer. The disclosure further provides an OLED display apparatus and a method for packaging an OLED device.

    Abstract translation: 本公开的实施例提供一种OLED显示面板,其包括:第一基板; 与第一基板相对布置的第二基板; 以及在所述第一基板和所述第二基板之间的导热层,第一包装粘合剂,第二包装粘合剂和OLED装置,其中所述第一包装粘合剂布置在所述第一基板和所述第二基板之间,并且包围密封空间, 第一基板和第二基板; 导热层形成在由第一包装粘合剂包围的空间内,并且包括具有不同导电率的至少两个区域,其中导热层的至少边缘区域具有比导热层的中心区更高的导电性; 第二包装粘合剂填充由第一基板,第二基板和第一包装粘合剂包围的空间,并且与导热层的表面接触。 本发明还提供了OLED显示装置和用于封装OLED器件的方法。

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