公开(公告)号：US4818821A

公开(公告)日：1989-04-04

申请号：US175450

申请日：1988-03-30

Applicant: Robert M. Wentworth ,  Brian Webb

Inventor： Robert M. Wentworth ,  Brian Webb

IPC: H01L23/10

CPC classification number: H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701

Abstract: A brazed leaded package is provided having buried brazed areas thereby eliminating the need of subsequent protective plating of the brazed areas. The package has a heat conductive support which supports a plurality of leads. The distal end of the leads terminate on the top of the heat conductive support in a braze pad to which are brazed formed leads for providing interface connection to a semiconductor integrated circuit contained within the package. The package can be sealed by using a solid ceramic cover having a glazed glass on its bottom side which is heated up to reflow and provide the seal.

Abstract translation: 钎焊的有铅封装被提供有埋入的钎焊区域，从而消除了对钎焊区域的后续保护电镀的需要。 该封装具有支撑多个引线的导热支撑。 引线的远端终止在钎焊焊盘上的导热支撑件的顶部上，钎焊的成形引线用于提供与包含在封装内的半导体集成电路的接口连接。 该封装可以通过使用在底部具有玻璃玻璃的固体陶瓷盖进行密封，该陶瓷盖被加热以回流并提供密封。