公开(公告)号：US20190160804A1

公开(公告)日：2019-05-30

申请号：US16197676

申请日：2018-11-21

Applicant: DISCO CORPORATION

Inventor： Kazuyuki HINOHARA ,  Haruki MATSUO ,  Kazuya HIRATA ,  Ryohei YAMAMOTO

IPC: B32B43/00

Abstract: A peeling apparatus includes an ingot holding unit holding an ingot in a hanging state where a portion of the ingot to be peeled off as the wafer is directed downwardly, a water container containing water therein, an ultrasonic unit immersed in the water in the water container, a moving unit moving the ingot holding unit vertically into a position where the ingot holding unit faces the ultrasonic unit and at least the portion of the ingot to be peeled off as the wafer is immersed in the water in the water container, and a nozzle ejecting water to the portion of the ingot to be peeled off as the wafer thereby to promote the peeling of the wafer from the ingot.