公开(公告)号：US20210043514A1

公开(公告)日：2021-02-11

申请号：US16944382

申请日：2020-07-31

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  H01L21/268 ,  H01L21/683 ,  H01L23/544

Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of picking up each device chip from the polyester sheet.

公开(公告)号：US20200235010A1

公开(公告)日：2020-07-23

申请号：US16743137

申请日：2020-01-15

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  H01L21/268 ,  H01L21/683

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of cooling the polyolefin sheet in each region of the polyolefin sheet corresponding to each device chip, pushing up each device chip from the polyolefin sheet side to pick up each device chip from the polyolefin sheet.

公开(公告)号：US20200126859A1

公开(公告)日：2020-04-23

申请号：US16598708

申请日：2019-10-10

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  H01L21/683 ,  H01L21/268

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of picking up each device chip from the polyolefin sheet.

公开(公告)号：US20200083103A1

公开(公告)日：2020-03-12

申请号：US16554914

申请日：2019-08-29

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  H01L21/683

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and then picking up each device chip from the polyolefin sheet.

公开(公告)号：US20210118736A1

公开(公告)日：2021-04-22

申请号：US17068925

申请日：2020-10-13

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  H01L21/02 ,  H01L21/304 ,  H01L21/447 ,  H01L21/768 ,  B23K26/364 ,  B23K26/40 ,  C09J7/25 ,  C09J7/30

Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of cooling the polyester sheet, pushing up each device chip through the polyester sheet, and picking up each device chip from the polyester sheet.

公开(公告)号：US20210111074A1

公开(公告)日：2021-04-15

申请号：US17063885

申请日：2020-10-06

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  B23K26/364 ,  B23K26/40 ,  C09J7/24 ,  C09J7/35

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and picking up each device chip from the polyolefin sheet.

公开(公告)号：US20210074588A1

公开(公告)日：2021-03-11

申请号：US17014572

申请日：2020-09-08

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  B23K26/364 ,  B23K26/40 ,  C09J7/24

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of blowing air to each device chip from the polyolefin sheet side to push up each device chip through the polyolefin sheet and picking up each device chip from the polyolefin sheet.

公开(公告)号：US20210013101A1

公开(公告)日：2021-01-14

申请号：US16916829

申请日：2020-06-30

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  H01L23/544 ,  H01L21/268 ,  H01L21/683

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyolefin sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyolefin sheet, then picking up each device chip from the polyolefin sheet.

公开(公告)号：US20200286785A1

公开(公告)日：2020-09-10

申请号：US16799291

申请日：2020-02-24

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  H01L21/268 ,  H01L21/683

Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of picking up each device chip from the polyester sheet.

公开(公告)号：US20200286784A1

公开(公告)日：2020-09-10

申请号：US16799161

申请日：2020-02-24

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  B23K26/364 ,  B23K26/40 ,  C09J7/24 ,  H01L21/304 ,  H01L21/683

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of picking up each device chip from the polyolefin sheet.