公开(公告)号：US20210111073A1

公开(公告)日：2021-04-15

申请号：US17063819

申请日：2020-10-06

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  H01L21/02 ,  H01L21/304 ,  H01L21/447 ,  H01L21/768 ,  B23K26/364 ,  B23K26/40 ,  C09J7/25 ,  C09J7/35

Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyester sheet, pushing up each device chip through the polyester sheet, and picking up each device chip from the polyester sheet.

公开(公告)号：US20200328118A1

公开(公告)日：2020-10-15

申请号：US16832266

申请日：2020-03-27

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  H01L21/683 ,  H01L21/268

Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of blowing out air to push up each device chip and picking up each device chip from the polyester sheet.

公开(公告)号：US20200185252A1

公开(公告)日：2020-06-11

申请号：US16696204

申请日：2019-11-26

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/683 ,  H01L21/78 ,  H01L21/268 ,  B32B37/06 ,  B32B9/04 ,  B32B7/12

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyolefin sheet in each region of the polyolefin sheet corresponding to each device chip, pushing up each device chip from the polyolefin sheet side to pick up each device chip from the polyolefin sheet.

公开(公告)号：US20210118737A1

公开(公告)日：2021-04-22

申请号：US17068936

申请日：2020-10-13

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  B23K26/364 ,  B23K26/40 ,  C09J7/24

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of cooling the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and picking up each device chip from the polyolefin sheet.

公开(公告)号：US20210043513A1

公开(公告)日：2021-02-11

申请号：US16944347

申请日：2020-07-31

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  B23K26/364 ,  B23K26/40 ,  C09J7/24

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of picking up each device chip from the polyolefin sheet.

公开(公告)号：US20200328117A1

公开(公告)日：2020-10-15

申请号：US16831953

申请日：2020-03-27

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  H01L21/268 ,  H01L21/683

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of blowing out air to push up each device chip and picking up each device chip from the polyolefin sheet.

公开(公告)号：US20200266090A1

公开(公告)日：2020-08-20

申请号：US16752943

申请日：2020-01-27

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/683 ,  H01L21/78 ,  H01L21/268 ,  H01L23/544 ,  B23K26/359

Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyester sheet in each region of the polyester sheet corresponding to each device chip, pushing up each device chip from the polyester sheet side to pick up each device chip from the polyester sheet.

公开(公告)号：US20200235011A1

公开(公告)日：2020-07-23

申请号：US16743176

申请日：2020-01-15

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  H01L21/268 ,  H01L21/683

Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of cooling the polyester sheet in each region of the polyester sheet corresponding to each device chip, pushing up each device chip from the polyester sheet side to pick up each device chip from the polyester sheet.

公开(公告)号：US20210013100A1

公开(公告)日：2021-01-14

申请号：US16916408

申请日：2020-06-30

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  H01L23/544 ,  H01L21/268 ,  H01L21/683

Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyester sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyester sheet, then picking up each device chip from the polyester sheet.

公开(公告)号：US20200266102A1

公开(公告)日：2020-08-20

申请号：US16774689

申请日：2020-01-28

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  H01L21/268 ,  H01L21/683

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyolefin sheet in each region of the polyolefin sheet corresponding to each device chip, pushing up each device chip from the polyolefin sheet side to pick up each device chip from the polyolefin sheet.