公开(公告)号：US20210076496A1

公开(公告)日：2021-03-11

申请号：US16564868

申请日：2019-09-09

申请人： Flex Ltd.

发明人： Weifeng Liu ,  William L. Uy ,  Alex Chan ,  Dongkai Shangguan

IPC分类号： H05K1/11 ,  H05K3/40 ,  H05K1/02 ,  H05K3/12 ,  H05K3/34 ,  H05K1/18 ,  H05K1/09

摘要： Attaching electronic components to a substrate utilizes conductive materials to attach the components and to form traces to allow electrical connectivity between pads receiving the components. Conductive inks are non-solderable and cannot be utilized as solder pads whereas solderable inks are non-conductive. By applying a substrate with conductive ink and then selectively applying a solderable ink on the conductive ink, electronic components may be attached to a substrate that provides mechanical attachment and electrical connectivity which may also be formable or flexible.

公开(公告)号：US20200344891A1

公开(公告)日：2020-10-29

申请号：US16450650

申请日：2019-06-24

申请人： Flex Ltd.

发明人： Weifeng Liu ,  William L. Uy ,  Dongkai Shangguan

IPC分类号： H05K3/28 ,  H05K1/18 ,  H05K5/06 ,  B29C51/12 ,  B29C51/10

摘要： Methods, devices, and systems for encapsulating a flexible electronic device with a waterproof layer are provided. In some embodiments, a manufacturing process is provided where a hotmelt layer is positioned over a flexible substrate that has at least one electronic component. Then, heat and/or pressure are applied to the hotmelt layer causing the hotmelt layer to flow around the at least one component to encapsulate the at least one component and form a waterproof layer. Various embodiments for forming the hotmelt layer and various embodiments of the flexible electronic device with the hotmelt layer are described herein.