Fingerprint sensing device with interposer structure

    公开(公告)号:US09672407B2

    公开(公告)日:2017-06-06

    申请号:US15168591

    申请日:2016-05-31

    Inventor: Karl Lundahl

    CPC classification number: G06K9/00053 G03F7/16 G06K9/00 G06K9/0002

    Abstract: The invention relates to a fingerprint sensing device comprising: a sensing chip comprising an array of sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of the sensing elements and a finger placed on a sensing surface of the sensing device. A surface of the sensing elements define a sensing plane. The sensing device further comprises a plurality of interposer structures arranged on the sensing chip extending above sensing plane, wherein the plurality of interposer structures have the same height above the sensing plane. A protective plate is attached to the sensing chip by means of an adhesive, and the protective plate rests on the interposer structures such that a distance between the protective plate and the sensing plane is defined by the height of the interposer structures.

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