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公开(公告)号：US10891459B2
公开(公告)日：2021-01-12
申请号：US16621302
申请日：2018-06-11
Applicant: FINGERPRINT CARDS AB
Inventor： Karl Lundahl
IPC: G06K7/08 , G06K9/00 , G06K19/077 , H01L21/48 , H01L21/56 , H01L21/683 , H01L23/31 , H01L23/538 , H01L23/00
Abstract: There is provided a fingerprint sensor module comprising a fingerprint sensor device comprising a sensing array and at least one connection pad for electrically connecting the fingerprint sensor device to external circuitry, the sensing array and connection pad being located on a first side of the fingerprint sensing device; at least one electrically conductive via connection arranged adjacent to the fingerprint sensor device and in electrical contact with the connection pad via at least one conductive trace located in the same plane as the connection pad; a mold layer arranged to cover a backside of the fingerprint sensor device and to fill a volume between the fingerprint sensor device and the via connection, wherein an end portion of the via connection is exposed for connecting the fingerprint sensor module to external circuitry. There is also provided a method for manufacturing such a fingerprint sensor module.
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公开(公告)号：US20170270345A1
公开(公告)日：2017-09-21
申请号：US15614007
申请日：2017-06-05
Applicant: Fingerprint Cards AB
Inventor： Karl Lundahl
CPC classification number: G06K9/00053 , G03F7/16 , G06K9/00 , G06K9/0002
Abstract: The invention relates to a fingerprint sensing device comprising: a sensing chip comprising an array of sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of the sensing elements and a finger placed on a sensing surface of the sensing device. A surface of the sensing elements defines a sensing plane. The sensing device further comprises a plurality of interposer structures arranged on the sensing chip extending above sensing plane, wherein the plurality of interposer structures have the same height above the sensing plane. A protective plate is attached to the sensing chip by means of an adhesive, and the protective plate rests on the interposer structures such that a distance between the protective plate and the sensing plane is defined by the height of the interposer structures.
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公开(公告)号：US09582704B2
公开(公告)日：2017-02-28
申请号：US14911573
申请日：2014-08-22
Applicant: Fingerprint Cards AB
Inventor： Pontus Jägemalm , Karl Lundahl , Mats Slottner , Hans Thörnblom , Ojie Julian
CPC classification number: G06K9/0002 , H01L24/03 , H01L24/05 , H01L24/09 , H01L24/48 , H01L24/49 , H01L2224/033 , H01L2224/0345 , H01L2224/03462 , H01L2224/035 , H01L2224/04042 , H01L2224/05022 , H01L2224/05624 , H01L2224/05647 , H01L2224/06179 , H01L2224/48091 , H01L2224/48148 , H01L2224/48465 , H01L2224/48471 , H01L2224/49175 , H01L2224/85186 , H01L2924/00014 , H01L2924/10155 , H01L2924/10157 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
Abstract: A fingerprint sensing device comprising sensing circuitry comprising a plurality of sensing elements, each sensing element comprising a sensing structure arranged in a sensing plane and facing a surface of the capacitive fingerprint sensing device, each of the sensing elements being configured to provide a signal indicative of an electromagnetic coupling between the sensing structure and a finger placed on the surface of the fingerprint sensing device; and a plurality of connection pads electrically connected to the sensing circuitry for providing an electrical connection between the sensing circuitry and readout circuitry, wherein each of the connection pads is separately recessed in relation to the sensing plane such that each connection pad has a floor in a floor plane, and wherein each connection pad is separated from an adjacent connection pad through a portion of the sensing device being elevated in relation to the floor plane.
Abstract translation: 一种指纹感测装置，包括感测电路，其包括多个感测元件，每个感测元件包括布置在感测平面中并面向电容式指纹感测装置的表面的感测结构，每个感测元件被配置为提供指示 感测结构和放置在指纹感测装置的表面上的手指之间的电磁耦合; 以及电连接到感测电路的多个连接焊盘，用于在感测电路和读出电路之间提供电连接，其中每个连接焊盘相对于感测平面分别凹陷，使得每个连接焊盘具有位于 底板平面，并且其中每个连接垫通过相对于底板平面升高的感测装置的一部分与相邻的连接垫分离。
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公开(公告)号：US11288476B2
公开(公告)日：2022-03-29
申请号：US16609684
申请日：2018-04-25
Applicant: FINGERPRINT CARDS AB
Inventor： Hanna Nilsson , Karl Lundahl
Abstract: The present invention generally relates to a fingerprint sensor package comprising a substrate having thereon a plurality of electrical connection pads, a fingerprint sensor arranged on the substrate and electrically connected to at least one of the electrical connection pads, a bond wire loop formed from a bond wire having two ends of which at least one end is mechanically and electrically attached to a first one of the electrical connection pads, and a force sensing member in electrical contact with the first electrical connection pad via an upper portion of the bond wire loop, and in electrical contact with a second one of the electrical connection pads different from the first electrical connection pad, wherein an electrical property of the force sensing member is alterable in response to a deformation of the force sensing member.
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公开(公告)号：US09842244B2
公开(公告)日：2017-12-12
申请号：US15614007
申请日：2017-06-05
Applicant: Fingerprint Cards AB
Inventor： Karl Lundahl
CPC classification number: G06K9/00053 , G03F7/16 , G06K9/00 , G06K9/0002
Abstract: The invention relates to a fingerprint sensing device comprising: a sensing chip comprising an array of sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of the sensing elements and a finger placed on a sensing surface of the sensing device. A surface of the sensing elements defines a sensing plane. The sensing device further comprises a plurality of interposer structures arranged on the sensing chip extending above sensing plane, wherein the plurality of interposer structures have the same height above the sensing plane. A protective plate is attached to the sensing chip by means of an adhesive, and the protective plate rests on the interposer structures such that a distance between the protective plate and the sensing plane is defined by the height of the interposer structures.
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Patent Agency Ranking
公开(公告)号：US09842243B2
公开(公告)日：2017-12-12
申请号：US15138525
申请日：2016-04-26
Applicant: Fingerprint Cards AB
Inventor： Karl Lundahl
IPC: G06K9/00
CPC classification number: G06K9/00053 , G06K9/00
Abstract: The invention relates to a fingerprint sensing device comprising a sensing chip comprising an array of capacitive sensing elements. The sensing device comprises a coating material arranged in a layer on top of the array of sensing elements, the coating material comprising a plurality of cavities filled with a mold material; wherein locations of the cavities correspond to locations of the sensing elements, such that a cross-section area of a cavity covers at least a portion of an area of a corresponding sensing element; and wherein a dielectric constant of the mold material is higher than a dielectric constant of the coating material. The invention also relates to a method for manufacturing such a device.
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公开(公告)号：US20160358008A1
公开(公告)日：2016-12-08
申请号：US15168591
申请日：2016-05-31
Applicant: Fingerprint Cards AB
Inventor： Karl Lundahl
IPC: G06K9/00
CPC classification number: G06K9/00053 , G03F7/16 , G06K9/00 , G06K9/0002
Abstract: The invention relates to a fingerprint sensing device comprising: a sensing chip comprising an array of sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of the sensing elements and a finger placed on a sensing surface of the sensing device, wherein a surface of the sensing elements define a sensing plane; a plurality of interposer structures arranged on the sensing chip extending above sensing plane, wherein the plurality of interposer structures have substantially the same height above the sensing plane; and a protective plate attached to the sensing chip by means of an adhesive arranged on the sensing chip, wherein the protective plate rests on the interposer structures such that a distance between the protective plate and the sensing plane is defined by the height of the interposer structures.
Abstract translation: 本发明涉及一种指纹感测装置，包括：感测芯片，包括感测元件阵列，其被配置为连接到读出电路，用于检测每个感测元件之间的电容耦合以及放置在感测装置的感测表面上的手指 ，其中所述感测元件的表面限定感测平面; 布置在感测芯片上方的多个中介层结构，其在感测平面上方延伸，其中多个中介层结构在感测平面之上具有基本相同的高度; 以及通过布置在感测芯片上的粘合剂附接到感测芯片的保护板，其中保护板搁置在插入件结构上，使得保护板和感测平面之间的距离由插入件结构的高度限定 。
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公开(公告)号：US11295189B2
公开(公告)日：2022-04-05
申请号：US15733899
申请日：2019-05-27
Applicant: FingerPrint Cards AB
Inventor： Karl Lundahl , Olivier Lignier
IPC: G06K5/00 , G06K19/07 , G06K19/077
Abstract: Method for manufacturing a smartcard comprising a fingerprint sensor, the method comprising: arranging a fingerprint sensor module in an opening of a carrier layer of a smartcard body; forming a cavity in the smartcard in an area corresponding to a sensing area of the fingerprint sensor module; forming a plurality of surface structures in the cavity of the smartcard; depositing a liquid hydrophobic material in the cavity to at least partially cover the surface structures and a smartcard manufactured according to the described method.
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公开(公告)号：US09977945B2
公开(公告)日：2018-05-22
申请号：US15464680
申请日：2017-03-21
Applicant: Fingerprint Cards AB
Inventor： Karl Lundahl , Robert Hägglund , Emil Hjalmarson , Rolf Sundblad , Christer Jansson
CPC classification number: G06K9/0002 , G06F3/0412 , G06F2203/0338 , G06F2203/04103 , G06K9/00087
Abstract: There is provided a capacitive fingerprint sensing device for sensing a fingerprint pattern of a finger, said capacitive fingerprint sensing device comprising: a protective top layer to be touched by said finger; a first metal layer comprising a two-dimensional array of sensing structures arranged underneath said top layer; a second metal layer, arranged underneath said first metal layer, comprising a plurality of conductive structures a dielectric layer arranged between the first and second metal layers to electrically insulate the first metal layer from the second metal layer, the dielectric layer comprising a low-k material; and readout circuitry arranged underneath said second metal layer and coupled to each of the electrically conductive sensing structures by means of via connections to receive a sensing signal indicative of a distance between said finger and said sensing structure. There is also provided a method for manufacturing such a device.
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公开(公告)号：US20170351895A1
公开(公告)日：2017-12-07
申请号：US15464680
申请日：2017-03-21
Applicant: Fingerprint Cards AB
Inventor： Karl Lundahl , Robert Hägglund , Emil Hjalmarson , Rolf Sundblad , Christer Jansson
IPC: G06K9/00
CPC classification number: G06K9/0002 , G06F3/0412 , G06F2203/0338 , G06F2203/04103 , G06K9/00087
Abstract: There is provided a capacitive fingerprint sensing device for sensing a fingerprint pattern of a finger, said capacitive fingerprint sensing device comprising: a protective top layer to be touched by said finger; a first metal layer comprising a two-dimensional array of sensing structures arranged underneath said top layer; a second metal layer, arranged underneath said first metal layer, comprising a plurality of conductive structures a dielectric layer arranged between the first and second metal layers to electrically insulate the first metal layer from the second metal layer, the dielectric layer comprising a low-k material; and readout circuitry arranged underneath said second metal layer and coupled to each of the electrically conductive sensing structures by means of via connections to receive a sensing signal indicative of a distance between said finger and said sensing structure. There is also provided a method for manufacturing such a device.
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