公开(公告)号：US20150288801A1

公开(公告)日：2015-10-08

申请号：US14679351

申请日：2015-04-06

Applicant: Google, Inc.

Inventor： David Fishman ,  Seth Newburg ,  Ara Knaian ,  Marisa Bober ,  Paul Eremenko

IPC: H04M1/725 ,  G06F1/20

CPC classification number: H04B5/0037 ,  G06F1/203 ,  H04B5/0012 ,  H04B5/0075 ,  H04M1/0254 ,  H04M1/72575 ,  H04W4/80

Abstract: A system for enabling a chassis-coupled modular mobile electronic device includes a thermally conductive chassis, a set of module couplers that couple modules of the modular mobile electronic device to the chassis (both thermally and mechanically), a module communication network configured to enable data transfer between the modules, and a module power network configured to enable power transfer between the modules when the modules are coupled to the chassis.

Abstract translation: 一种用于启用机箱耦合的模块化移动电子设备的系统包括导热底盘，将模块化移动电子设备的模块耦合到机箱（热和机械）的一组模块耦合器，模块通信网络，被配置为使能数据 模块之间的传输以及模块电源网络，其被配置为当模块耦合到机箱时在模块之间实现功率传输。

公开(公告)号：US20150277503A1

公开(公告)日：2015-10-01

申请号：US14626723

申请日：2015-02-19

Applicant: Google, Inc.

Inventor： Paul Eremenko ,  Ara Knaian ,  Seth Newburg ,  David Fishman

IPC: G06F1/16 ,  H04M1/02 ,  H04W88/02

CPC classification number: G06F1/1658 ,  G06F1/1684 ,  H04M1/0254 ,  H04M1/0274 ,  H04W88/02 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/044

Abstract: Examples herein include modules and connections for modules to couple to a computing device. An example module includes a housing comprising an end to couple to a computing device, multiple capacitive pads that each include data contacts to enable data transfer, a power contact pad to provide or receive power, and a ground contact pad to couple to ground. The ground contact pad is larger in size than the power contact pad, and the ground contact pad is positioned closer than the power contact pad to the end of the housing configured to couple to the computing device.

Abstract translation: 本文的示例包括用于耦合到计算设备的模块的模块和连接。 示例性模块包括壳体，其包括耦合到计算设备的端部，多个电容焊盘，每个电容焊盘包括用于实现数据传输的数据触点，功率接触焊盘以提供或接收电力，以及接地触点焊盘以耦合到地。 接地焊盘的尺寸大于电源接触焊盘，并且接地焊盘定位成比电源接触焊盘更接近配置成耦合到计算设备的壳体的端部。