公开(公告)号：US10234879B2

公开(公告)日：2019-03-19

申请号：US15725995

申请日：2017-10-05

Applicant: Google LLC

Inventor： Eric Marschalkowski ,  Orville Buenaventura ,  Daniel Adam Warren

IPC: G08B21/00 ,  G05D23/19 ,  H02H11/00

Abstract: A thermostat may include one or more processors and heating, ventilation, and air conditioning (HVAC) wire connectors configured to receive HVAC wires from an HVAC system, including a call relay wire connector and a power return wire connector. The thermostat may also include an integrated circuit (IC) coupled to the one or more processors. The IC may include one or more solid-state switching elements for actuating at least one HVAC function through the call relay wire connector and the power return wire connector; a first input/output (I/O) pin coupled to the one or more solid-state switching elements; and a second I/O pin coupled to a substrate of the IC. The thermostat may further include a Schottky diode coupled between the first I/O pin and the second I/O pin, wherein the Schottky diode is external to the IC.

公开(公告)号：US20180136677A1

公开(公告)日：2018-05-17

申请号：US15725995

申请日：2017-10-05

Applicant: Google LLC

Inventor： Eric Marschalkowski ,  Orville Buenaventura ,  Daniel Adam Warren

IPC: G05D23/19

CPC classification number: G05D23/1917 ,  G05D23/1902 ,  H02H3/025 ,  H02H3/08 ,  H02H3/20

Abstract: A thermostat may include one or more processors and heating, ventilation, and air conditioning (HVAC) wire connectors configured to receive HVAC wires from an HVAC system, including a call relay wire connector and a power return wire connector. The thermostat may also include an integrated circuit (IC) coupled to the one or more processors. The IC may include one or more solid-state switching elements for actuating at least one HVAC function through the call relay wire connector and the power return wire connector; a first input/output (I/O) pin coupled to the one or more solid-state switching elements; and a second I/O pin coupled to a substrate of the IC. The thermostat may further include a Schottky diode coupled between the first I/O pin and the second I/O pin, wherein the Schottky diode is external to the IC.