Termination ring with gapped metallic layer

    公开(公告)号:US10814629B2

    公开(公告)日:2020-10-27

    申请号:US16305528

    申请日:2016-09-19

    Abstract: In one example in accordance with the present disclosure, a fluid ejection device is described. The fluid ejection device includes a substrate and a number of nozzles formed within the substrate to eject fluid. A number of bond pads are disposed on the substrate and are electrically coupled to the number of rows of nozzles. A termination ring is disposed on the substrate and surrounds the rows of nozzles. The termination ring includes a first metallic layer that is an enclosed shape and a second metallic layer that is disposed on top of the first metallic layer. The second metallic layer includes a gap positioned adjacent the number of bond pads.

    Dissipating heat of heating elements

    公开(公告)号:US10752015B2

    公开(公告)日:2020-08-25

    申请号:US16323219

    申请日:2016-10-20

    Abstract: In some examples, a heater assembly for a pattern forming system includes a support, and heating elements mounted on the support, where the heating elements are to, in response to activation of the heating element, produce heat directed towards a target to form a pattern on the target. A heat sink is thermally connected to the heating elements and comprising a pattern of heat dissipation surfaces comprising channels to dissipate heat produced by the heating elements.

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