公开(公告)号：US20210197492A1

公开(公告)日：2021-07-01

申请号：US17199375

申请日：2021-03-11

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Jordi Sanroma Garrit ,  Enrique Gurdiel Gonzalez ,  Victor Diego Gutierrez ,  Manuel Freire Garcia

IPC: B29C64/393 ,  G06F30/00

Abstract: In an example, a method includes receiving, at least one processor, object model data representing at least a portion of an object that is to be generated by an additive manufacturing apparatus by fusing build material within a fabrication chamber. An intended object placement location within the fabrication chamber may be determined, and a dimensional compensation to apply to the object model data may be determined using a mapping resource relating dimensional compensations to object placement locations. The determined dimensional compensation may be applied to the object model data to generate modified object model data using at least one processor.

公开(公告)号：US20200223144A1

公开(公告)日：2020-07-16

申请号：US16246046

申请日：2019-01-11

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Jordi Sanroma Garrit ,  Enrique Gurdiel Gonzalez ,  Victor Diego Gutierrez ,  Manuel Freire Garcia

IPC: B29C64/393 ,  G06F17/50

Abstract: In an example, a method includes receiving, at at least one processor, object model data representing at least a portion of an object that is to be generated by an additive manufacturing apparatus by fusing build material within a fabrication chamber. An intended object placement location within the fabrication chamber may be determined, and a dimensional compensation to apply to the object model data may be determined using a mapping resource relating dimensional compensations to object placement locations. The determined dimensional compensation may be applied to the object model data to generate modified object model data using at least one processor.