公开(公告)号：US20190059178A1

公开(公告)日：2019-02-21

申请号：US16078224

申请日：2016-02-23

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： David A. Moore ,  John Franz ,  Jonathon Hughes ,  Rahul V. Joshi ,  John Vijil

IPC: H05K7/20

Abstract: Examples herein disclose a multi-channel apparatus include a first channel and a second channel. The first channel receives heated air from an electrical component. The first channel deflects the heated air from a posterior electrical component. The deflection of the heated air is caused by a curvature of an internal partition. The second channel, which is segmented from the first channel via the internal partition, provides cool air to the posterior electrical component.

公开(公告)号：US20180317347A1

公开(公告)日：2018-11-01

申请号：US15772903

申请日：2015-12-18

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Tahir Cader ,  David A. Moore ,  Greg Scott Long

IPC: H05K7/20 ,  G05D7/06 ,  G05B15/02

CPC classification number: G06F1/20 ,  G06F17/5009 ,  H05K7/2079 ,  H05K7/20836

Abstract: An example device in accordance with an aspect of the present disclosure includes a collection engine and a correlation engine to identify cooling loop characteristics. The collection engine is to collect data from devices associated with cooling loops. The correlation engine is to identify, based on the data collected, a common loop from among the cooling loops, and which of the devices are associated with the common loop.

公开(公告)号：US20180017341A1

公开(公告)日：2018-01-18

申请号：US15717313

申请日：2017-09-27

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John P. Franz ,  Tahir Cader ,  Michael L. Sabotta ,  David A. Moore

IPC: F28F1/40 ,  H01L23/473 ,  H05K7/20

CPC classification number: F28F1/40 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20254 ,  H05K7/20781 ,  H01L2924/00

Abstract: An assembly for liquid cooling is provided herein. The assembly 8includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.