公开(公告)号：US12227433B2

公开(公告)日：2025-02-18

申请号：US15569650

申请日：2016-02-19

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  Greg Scott Long ,  John Franz ,  Gardson Githu

IPC: G01N27/02 ,  A61L2/18 ,  C02F1/00 ,  G01N33/18 ,  C02F1/50 ,  C02F1/66 ,  C02F103/02 ,  G01N27/416

Abstract: In the examples provided herein, a system includes an electrochemical sensor having two electrodes inserted in a fluid to be tested, where an alternative current (AC) voltage is applied across the two electrodes; an electrochemical sensor having two electrodes inserted in a fluid to be tested, wherein an alternative current (AC) voltage across the two electrodes; and a frequency response analyzer to analyze the measured the electrical response across multiple frequencies. The system also includes a memory to store a baseline of the electrical response across multiple frequencies, and a processor to determine from the stored baseline and the measured electrical response whether the electrical response is outside a predetermined range.

公开(公告)号：US11785743B2

公开(公告)日：2023-10-10

申请号：US17237732

申请日：2021-04-22

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Ernesto Ferrer

IPC: H05K7/20 ,  H05K1/02 ,  H05K5/02

CPC classification number: H05K7/20336 ,  H05K1/0201 ,  H05K5/0213 ,  H05K7/20327

Abstract: A thin, single-layer thermally conductive jacket surrounds a PCA. One or more living springs integrated in the jacket exert compressive force on PCA components where cooling is desired. The compressive force creates and maintains a thermal contact though which heat is conducted out of the PCA components and into the jacket. The jacket conducts the heat (either directly or indirectly) to a liquid-cooled cold plate configured as a cooling frame surrounding one or more of the jacketed PCAs. The jacket, optionally through intermediate thermal transfer devices such as heat spreaders or heat pipes, transfers heat from components on the PCA to the cooling frame. Liquid flowing through the cooling frame's internal channels convects the heat out of the electronic device. Turbulence encouraged by turbulence enhancing artifacts including bends and shape-changes along the internal channels increases the efficiency of the convection.

公开(公告)号：US11536402B2

公开(公告)日：2022-12-27

申请号：US16579254

申请日：2019-09-23

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Tahir Cader

IPC: F16L21/035 ,  F16L21/03 ,  H05K7/20

Abstract: Hose barb fittings and apparatuses described herein provide increased fluid-flow rates for cooling loops used for thermal control in computer system. A hose barb fitting comprises a fluid-flow passage that extends through the hose barb fitting from a first opening to a second opening. The ratio of the cross-sectional area of the fluid-flow passage to the cross-sectional area of the hose barb fitting is between 0.4 and 0.7, inclusive. When the hose barb fitting is fully seated within a housing structure, a specialized gasket acts as both a radial seal and a face seal. Also, a flange extending from the housing structure engages with a flange extending from the hose barb fitting to prevent the hose barb fitting from being unseated.

公开(公告)号：US20220240416A1

公开(公告)日：2022-07-28

申请号：US17155304

申请日：2021-01-22

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey J. Lunsman ,  Ernesto Ferrer ,  John Franz

IPC: H05K7/20

Abstract: Example implementations relate to an electronic system providing thermal management of a removable device when connected to a host device of the electronic system including a receptacle, and a heat transfer device having first and second portions. The host device has a cooling component. The removable device having a heat spreader, is detachably coupled to the host device. The receptacle having spring fingers, is coupled to one of the cooling component or the heat spreader. The first portion is coupled to one of the cooling component or the heat spreader, and the second portion is protruded outwards. When the removable device is connected to the host device, the second portion extends through the receptacle such that the spring fingers establish direct thermal interface with the second portion to allow waste-heat to transfer between the heat transfer device and one of the cooling component or the heat spreader via the receptacle.

公开(公告)号：US20200315061A1

公开(公告)日：2020-10-01

申请号：US16364980

申请日：2019-03-26

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Tahir Cader

IPC: H05K7/20 ,  F04D29/58

Abstract: A pump includes an armature, a rotor assembly, a liquid path connector and a member. The armature includes a ferromagnetic core, a winding and a through passageway. The rotor assembly is disposed in the passageway and includes an impeller to rotate to pump liquid through the passageway. The liquid path connector is connected to the armature to communicate the liquid with the passageway. The member contacts an outer surface of the armature and contacts an outer surface of the liquid path connector to transfer thermal energy from the armature to the liquid path connector.

公开(公告)号：US10716240B2

公开(公告)日：2020-07-14

申请号：US16078224

申请日：2016-02-23

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： David A. Moore ,  John Franz ,  Jonathon Hughes ,  Rahul V. Joshi ,  John Vijil

IPC: H05K7/20 ,  G06F1/20

Abstract: Examples herein disclose a multi-channel apparatus include a first channel and a second channel. The first channel receives heated air from an electrical component. The first channel deflects the heated air from a posterior electrical component. The deflection of the heated air is caused by a curvature of an internal partition. The second channel, which is segmented from the first channel via the internal partition, provides cool air to the posterior electrical component.

公开(公告)号：US10571635B1

公开(公告)日：2020-02-25

申请号：US16121984

申请日：2018-09-05

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Kevin B. Leigh ,  Everett R. Salinas ,  John Franz

IPC: G02B6/38 ,  G02B6/35 ,  H04Q11/00 ,  H01R12/71

Abstract: Systems and methods are provided for a nested co-blindmate high-density optical switch system. The nested co-blindmate high-density optical switch system can include a system enclosure, and an enclosure midplane that is installed the system enclosure. Further, a switch chassis can be enclosed by the system enclosure, and liquid blindmate to a liquid line on a rack; optically blindmate to at least one blade in the system enclosure; and electrically blindmate to the enclosure midplane. At least one optical switch line-card can be included in the system, which is enclosed by the switch chassis, and further enclosed by the system enclosure in a nested manner. The at least one optical switch line-cards can liquid blindmate to the switch chassis, optically blindmate to the switch chassis, and electrically blindmate to the enclosure midplane.

公开(公告)号：US10444147B2

公开(公告)日：2019-10-15

申请号：US15211875

申请日：2016-07-15

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  John Franz ,  William K Norton

IPC: G01N21/00 ,  G01N21/59 ,  G01N21/85 ,  G01N21/94 ,  G01N21/47

Abstract: Example implementations relate to an optical biofilm probe. For example, in an implementation, the optical biofilm probe may include a light source to project light towards a substrate disposed within a bypass and a detector to detect light from the substrate. Properties of light detected by the detector may be affected by biofilm formation on the substrate. The bypass may be connected in parallel to a conduit of a fluid system.

公开(公告)号：US20180376611A1

公开(公告)日：2018-12-27

申请号：US16066869

申请日：2016-01-29

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Zheila N. Madanipour ,  Vincent W. Michna ,  Patrick Raymond ,  John Franz

IPC: H05K7/14 ,  G06F1/18 ,  H05K7/20

Abstract: According to an example, a server may include a housing including a bottom portion, a first node defined by first and second printed circuit assemblies, and a second node defined by third and fourth printed circuit assemblies.

公开(公告)号：US20180032113A1

公开(公告)日：2018-02-01

申请号：US15550500

申请日：2015-02-13

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John Franz ,  Tahir Cader ,  William K. Norton

IPC: G06F1/20 ,  G05D23/19 ,  H05K7/20

CPC classification number: G06F1/20 ,  F28D15/00 ,  G05D23/1928 ,  G06F2200/201 ,  H05K7/20 ,  H05K7/20781

Abstract: An example method includes positioning a thermal bus bar into a bus bar support channel of a cooling wall, the cooling wall comprising a plurality of thermal bus bars. The positioning comprises removably connecting first portions of at least two dripless connectors coupled to a fluid flow path of the thermal bus bar to second portions of the dripless connectors coupled to coolant transport lines that receive and return coolant from a coolant source. The method further includes flowing coolant received from the coolant transport lines through the fluid flow path and returning the coolant to the coolant transport lines. The thermal bus bar is positioned while coolant provided by the coolant transport lines is flowing through other thermal bus bars of the cooling wall.