公开(公告)号：US20220316786A1

公开(公告)日：2022-10-06

申请号：US17720730

申请日：2022-04-14

Applicant: INERTECH IP LLC

Inventor： Gerald McDonnell ,  Ming Zhang ,  John Costakis ,  Earl Keisling

IPC: F25D17/02 ,  F25B25/00

Abstract: The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio.

公开(公告)号：US20210048230A1

公开(公告)日：2021-02-18

申请号：US16989880

申请日：2020-08-10

Applicant: INERTECH IP LLC

Inventor： Ming Zhang ,  John Costakis

IPC: F25B7/00 ,  F25B25/00 ,  H05K7/20 ,  F25B41/04 ,  F25B49/02

Abstract: The cooling systems of the present disclosure include a first refrigerant circuit in thermal communication with a heat load and in fluid communication with a main condenser, a free cooling circuit in fluid communication with the main condenser and a free-cooled water source, a chilled water circuit in fluid communication with the main condenser and an evaporator, and a second refrigerant circuit in fluid communication with the evaporator and a secondary condenser. The free cooling circuit is in thermal communication with the first refrigerant circuit via the main condenser, the chilled water circuit is in thermal communication with the first refrigerant circuit via the main condenser, and the second refrigeration circuit is in thermal communication with the chilled water circuit and the free cooling circuit. The second refrigeration circuit cools a fluid flowing in the chilled water circuit. Methods of operating a cooling system are also disclosed.

公开(公告)号：US10254021B2

公开(公告)日：2019-04-09

申请号：US14520322

申请日：2014-10-21

Applicant: Inertech IP LLC

Inventor： Gerald McDonnell ,  Ming Zhang ,  John Costakis ,  Earl Keisling

IPC: H05K7/20 ,  F25B29/00

Abstract: The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio.

公开(公告)号：US20170205119A1

公开(公告)日：2017-07-20

申请号：US15479588

申请日：2017-04-05

Applicant: Inertech IP LLC

Inventor： Ming Zhang ,  John Costakis

IPC: F25B7/00 ,  F25B49/02 ,  F25B41/04

CPC classification number: F25B7/00 ,  F25B25/005 ,  F25B41/04 ,  F25B49/02 ,  F25B2500/18 ,  H05K7/20827

Abstract: The cooling systems of the present disclosure include a first refrigerant circuit in thermal communication with a heat load and in fluid communication with a main condenser, a free cooling circuit in fluid communication with the main condenser and a free-cooled water source, a chilled water circuit in fluid communication with the main condenser and an evaporator, and a second refrigerant circuit in fluid communication with the evaporator and a secondary condenser. The free cooling circuit is in thermal communication with the first refrigerant circuit via the main condenser, the chilled water circuit is in thermal communication with the first refrigerant circuit via the main condenser, and the second refrigeration circuit is in thermal communication with the chilled water circuit and the free cooling circuit. The second refrigeration circuit cools a fluid flowing in the chilled water circuit. Methods of operating a cooling system are also disclosed.