ELECTRONIC DEVICE
    21.
    发明申请
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20200249516A1

    公开(公告)日:2020-08-06

    申请号:US16730934

    申请日:2019-12-30

    Abstract: A display device is provided and includes a first polymer substrate, a plurality of thin-film transistors, a second polymer substrate, and a liquid crystal layer. The thin-film transistors are disposed on the first polymer substrate. The second polymer substrate is disposed opposite to the first polymer substrate. The liquid crystal layer is disposed between the first polymer substrate and the second polymer substrate. The first polymer substrate has a first thickness, the second polymer substrate has a second thickness, and the first thickness is greater than the second thickness.

    ELECTRONIC STRUCTURE
    22.
    发明申请

    公开(公告)号:US20240419024A1

    公开(公告)日:2024-12-19

    申请号:US18822434

    申请日:2024-09-02

    Abstract: An electronic structure includes a substrate, a plurality of electronic units disposed on the substrate, a circuit structure electrically connected with at least one of the plurality of electronic units, and a support element disposed under the substrate. The substrate has a first flat part and a curved part connected with the first flat part. At least two adjacent ones of the plurality of electronic units on the first flat part have a first pitch. A least another two adjacent ones of the plurality of electronic units on the curved part have a second pitch different from the first pitch. In a normal direction of the first flat part, at least a portion of the circuit structure overlaps a region between the at least two adjacent ones of the plurality of electronic units on the first flat part. The circuit structure is disposed under the support element.

    Electromagnetic wave emitting structure

    公开(公告)号:US11809029B2

    公开(公告)日:2023-11-07

    申请号:US17942186

    申请日:2022-09-12

    CPC classification number: G02F1/133305 G02F1/133308 G02F1/133548

    Abstract: An electromagnetic wave emitting structure is provided in this disclosure. The electromagnetic wave emitting structure includes a substrate and a plurality of electromagnetic wave emitting units. The substrate has a first flat part and a foldable part connected with the first flat part. The plurality of electromagnetic wave emitting units are disposed on the substrate. Two adjacent ones of the plurality of electromagnetic wave emitting units on the first flat part have a first pitch in a first direction parallel to a surface of the first flat part, and another two adjacent ones of the plurality of electromagnetic wave emitting units on the foldable part have a second pitch in a second direction parallel to a surface of the foldable part. The second pitch is different from the first pitch.

    ELECTRONIC DEVICE
    25.
    发明申请

    公开(公告)号:US20220352214A1

    公开(公告)日:2022-11-03

    申请号:US17864353

    申请日:2022-07-13

    Abstract: The present disclosure provides an electronic device including a first metal layer, a first insulating layer, a second insulating layer, a second metal layer and a first transparent electrode. The first insulating layer is disposed on the first metal layer. The second insulating layer is disposed on the first insulating layer. The second metal layer is disposed between the first metal layer and the second insulating layer. A first via hole penetrates through the first insulating layer and the second insulating layer and exposes a portion of the first metal layer. A second via hole penetrates through the second insulating layer and exposes a portion of the second metal layer. The first transparent electrode is disposed on the second insulating layer and electrically connected to the first metal layer through the first via hole and electrically connected to the second metal layer through the second via hole.

    Flexible display device and method for manufacturing thereof

    公开(公告)号:US11348489B2

    公开(公告)日:2022-05-31

    申请号:US17099805

    申请日:2020-11-17

    Abstract: The present disclosure provides a flexible display device and a method for manufacturing the flexible display device. The method for manufacturing the flexible display device includes the following steps. First, a flexible substrate and a bonding structure are provided, in which the bonding structure is disposed on the flexible substrate. Subsequently, an anisotropic conductive film is provided on the bonding structure. Then, a driving circuit is provided on the anisotropic conductive film. Thereafter, the anisotropic conductive film is cured at a bonding temperature greater than or equal to 140° C. and less than or equal to 165° C.

    ELECTRONIC DEVICE
    27.
    发明申请

    公开(公告)号:US20210318571A1

    公开(公告)日:2021-10-14

    申请号:US17198281

    申请日:2021-03-11

    Abstract: An electronic device is provided in this disclosure. The electronic device includes a panel and an electromagnetic wave emitting structure. The panel has a first curved portion. The electromagnetic wave emitting structure has a second curved portion, and the second curved portion is corresponding to the first curved portion. The electromagnetic wave emitting structure includes a substrate and a plurality of electromagnetic wave emitting units. The plurality of electromagnetic wave emitting units are disposed on the substrate, and at least one of the plurality of electromagnetic wave emitting units is in the second curved portion.

    Flexible display device and method for manufacturing thereof

    公开(公告)号:US20210192985A1

    公开(公告)日:2021-06-24

    申请号:US17099805

    申请日:2020-11-17

    Abstract: The present disclosure provides a flexible display device and a method for manufacturing the flexible display device. The method for manufacturing the flexible display device includes the following steps. First, a flexible substrate and a bonding structure are provided, in which the bonding structure is disposed on the flexible substrate. Subsequently, an anisotropic conductive film is provided on the bonding structure. Then, a driving circuit is provided on the anisotropic conductive film. Thereafter, the anisotropic conductive film is cured at a bonding temperature greater than or equal to 140° C. and less than or equal to 165° C.

    ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20210181563A1

    公开(公告)日:2021-06-17

    申请号:US17113124

    申请日:2020-12-07

    Abstract: An electronic device and a manufacturing method thereof are disclosed in the present disclosure. The electronic device comprises a first flexible substrate, a second flexible substrate and a sealing material. The first flexible substrate comprises a first laser-cutting buffer region, and the first flexible substrate comprises a first edge. The second flexible substrate comprises a second laser-cutting buffer region, and the second flexible substrate comprises a second edge. The sealing material is disposed between the first flexible substrate and the second flexible substrate. The sealing material is away from the first edge by the first laser-cutting buffer region and the sealing material is away from the second edge by the second laser-cutting buffer region. Therefore, the cracking of the sealing material can be reduced.

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