公开(公告)号：US10553548B2

公开(公告)日：2020-02-04

申请号：US15635555

申请日：2017-06-28

Applicant: Intel Corporation

Inventor： Nicholas Neal ,  Nicholas S. Haehn

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/18 ,  H01L23/373 ,  H01L23/367 ,  H01L25/065 ,  H01L25/00 ,  H01L21/48 ,  H01L21/56

Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures formed herein may include a first die disposed on a substrate, a second die disposed on the substrate, a molding compound disposed between the first die and the second die, wherein the molding compound is disposed on a top surface of the substrate. An epoxy material is disposed between a top portion of a sidewall of the first die and the molding compound, and a thermal interface material (TIM) is disposed on top surfaces of the first and second die, wherein the TIM extends over the entire length of the substrate.