公开(公告)号：US06507493B2

公开(公告)日：2003-01-14

申请号：US09791777

申请日：2001-02-26

申请人： Akira Ueda ,  Masumi Suzuki ,  Minoru Hirano ,  Toyokazu Hamaguchi ,  Shigeru Hidesawa

发明人： Akira Ueda ,  Masumi Suzuki ,  Minoru Hirano ,  Toyokazu Hamaguchi ,  Shigeru Hidesawa

IPC分类号： H05K720

CPC分类号： G06F1/203 ,  G06F1/20

摘要： The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.